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參數(shù)資料
| 型號： | MPC755CRX400LE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 42/60頁 |
| 文件大小： | 1559K |
| 代理商： | MPC755CRX400LE |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 7.0
Freescale Semiconductor
47
System Design Information
Figure 26. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
8.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, Figure 27 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 25). This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers
the best thermal performance, considering the low interface pressure. Of course, the selection of any
thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
Figure 27 describes the thermal performance of select thermal interface materials.
External Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
(Note the internal versus external package resistance.)
Internal Resistance
Die/Package
Package/Leads
Die Junction
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| MPC755CRX400TE | 功能描述:微處理器 - MPU GF RV2.84A-40C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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