參數(shù)資料
型號(hào): MPC755CPX400LE
廠(chǎng)商: FREESCALE SEMICONDUCTOR INC
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, PBGA360
封裝: 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360
文件頁(yè)數(shù): 46/60頁(yè)
文件大小: 1559K
代理商: MPC755CPX400LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 7.0
50
Freescale Semiconductor
System Design Information
Figure 28. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the final operating die-junction temperature—airflow, board population (local
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as, system-level designs.
1
3
5
7
8
00.511.522.533.5
Thermalloy #2328B Pin-Fin Heat Sink
Approach Air Velocity (m/s)
(25
× 28 × 15 mm)
2
4
6
Heat
Sink
The
rma
lResistance
C/W)
相關(guān)PDF資料
PDF描述
MPC745BVT300LE 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255
MPC755BVT300LE 32-BIT, 300 MHz, RISC PROCESSOR, PBGA360
MPC823ZC25 32-BIT, RISC PROCESSOR, PBGA256
MPC823ZT50 32-BIT, RISC PROCESSOR, PBGA256
MPC823CZT25 32-BIT, RISC PROCESSOR, PBGA256
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755CPX400LE 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 400MHZ BGA-360
MPC755CPX400LER2 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CRX350LE 功能描述:微處理器 - MPU 360CBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CRX350TE 功能描述:微處理器 - MPU 360CBGA,RV2.8, RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CRX400LE 功能描述:微處理器 - MPU GF RV2.84A105C 360CBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324