參數(shù)資料
型號(hào): MPC745BPX400LE
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, PBGA255
封裝: 21 X 21 MM, PLASTIC, BGA-255
文件頁數(shù): 38/52頁
文件大?。?/td> 1276K
代理商: MPC745BPX400LE
MOTOROLA
MPC755 RISC Microprocessor Hardware Specifications
43
System Design Information
Figure 27. Thermal Performance of Select Thermal Interface Materials
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
0
0.5
1
1.5
2
0
10
203040
5060
70
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Sp
ec
ific
Th
erm
a
lR
e
s
ist
anc
e
(
K-in.
2
/W
)
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