MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
16
Freescale Semiconductor
Electrical and Thermal Characteristics
Figure 4 provides the AC test load for the MPC7410.
Figure 4. AC Test Load
SYSCLK to ARTRY, SHD0, SHD1 high impedance after precharge
tKHARPZ
—2
t
SYSCLK
3, 8, 9
Notes:
1. All input specifications are measured from the midpoint of the signal in question to the midpoint of the rising edge of the input
SYSCLK. All output specifications are measured from the midpoint of the rising edge of SYSCLK to the midpoint of the signal
in question. All output timings assume a purely resistive 50-
Ω load (see
Figure 4). Input and output timings are measured at
the pin; time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. The symbology used for timing specifications herein follows the pattern of t(signal)(state)(reference)(state) for inputs and
t(reference)(state)(signal)(state) for outputs. For example, tIVKH symbolizes the time input signals (I) reach the valid state (V)
relative to the SYSCLK reference (K) going to the high (H) state or input setup time. And tKHOV symbolizes the time from
SYSCLK(K) going high (H) until outputs (O) are valid (V) or output valid time. Input hold time can be read as the time that
the input signal (I) went invalid (X) with respect to the rising clock edge (KH)— note the position of the reference and its state
for inputs—and output hold time can be read as the time from the rising edge (KH) until the output went invalid (OX).
3. tSYSCLK is the period of the external clock (SYSCLK) in ns. The numbers given in the table must be multiplied by the period
of SYSCLK to compute the actual time duration (in ns) of the parameter in question.
4. Includes mode select signals: BVSEL, EMODE, L2VSEL. See
Figure 5 for mode select timing with respect to HRESET.
5. All other output signals are composed of the following— A[0:31], AP[0:3], TT[0:4], TS, TBST, TSIZ[0:2], GBL, WT, CI,
DH[0:31], DL[0:31], DP[0:7], BR, CKSTP_OUT, DRDY, HIT, QREQ, RSRV.
6. Output valid time is measured from 2.4 to 0.8 V which may be longer than the time required to discharge from VDD to 0.8 V.
7. According to the 60x bus protocol, ABB and DBB are driven only by the currently active bus master. They are asserted low
then precharged high before returning to high-Z as shown in
Figure 6. The nominal precharge width for ABB or DBB is 0.5
× tSYSCLK, that is, less than the minimum tSYSCLK period, to ensure that another master asserting ABB, or DBB on the
following clock will not contend with the precharge. Output valid and output hold timing is tested for the signal asserted.
Output valid time is tested for precharge. The high-Z behavior is guaranteed by design.
8. According to the 60x bus protocol, ARTRY can be driven by multiple bus masters through the clock period immediately
following AACK. Bus contention is not an issue since any master asserting ARTRY will be driving it low. Any master asserting
it low in the first clock following AACK will then go to high-Z for one clock before precharging it high during the second cycle
after the assertion of AACK. The nominal precharge width for ARTRY is 1.0 tSYSCLK; that is, it should be high-Z as shown in
Figure 6 before the first opportunity for another master to assert ARTRY. Output valid and output hold timing are tested for
the signal asserted. Output valid time is tested for precharge. The high-Z behavior is guaranteed by design.
9. Guaranteed by design and not tested.
Table 8. Processor Bus AC Timing Specifications 1 (continued)
At recommended operating conditions (see Table 3)
Parameter
Symbol 2
400, 450, 500 MHz
Unit
Notes
Min
Max
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω