參數(shù)資料
型號(hào): MPC7410RX450LD
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù): 46/56頁(yè)
文件大小: 864K
代理商: MPC7410RX450LD
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
50
Freescale Semiconductor
Document Revision History
1.1
Internal release.
Table 12—added note 16 for ABB/AMON and DBB/DMON signal clarification.
Table 12—changed CHK note 4 reference to note 2, signal is for factory test only. Changed previous
note 4 (CHK related) to now provide additional PLL info.
Table 1—modified maximum value for OVDD from –0.3 to 3.465 to now be –0.3 to 3.6 and L2OVDD
from –0.3 to 2.6 to now be –0.3 to 2.8. Modified note 6, OVDD for revisions prior to Rev. 1.4 have
maximum value for OVDD of –0.3 to 2.8.
Table 8—removed note 12. L2_TSTCLK is for factory use only (see Table 12, note 2).
Section 1.10.2—revised section to include nomenclature tables for part markings not covered by this
spec.
Figure 2—added that under/overshoot for L2OVDD references tL2CLK while OVDD references tSYSCLK.
Table 4—added HCTE package (HX package descriptor) thermal characteristics.
Section 1.5—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same pin assignments.
Section 1.6—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same pinout listings.
Section 1.7—added HCTE package (HX package descriptor). Both the CBGA and HCTE packages
have the same package parameters and dimensions.
Table 17—added HCTE package (HX package descriptor) to part numbering nomenclature.
Table 21—added MPC7410THXnnnLE extended temperature HCTE package part numbers and part
number specification document reference.
Table 16. Document Revision History (continued)
Revision
Date
Substantive Change(s)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC7410RX450NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum
MPC7410RX500LE 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤(pán)
MPC7410THX400LE 功能描述:微處理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410THX400NE 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk
MPC7410THX450NE 功能描述:微處理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324