參數(shù)資料
型號(hào): MPC7410RX400LE
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁(yè)數(shù): 26/56頁(yè)
文件大?。?/td> 864K
代理商: MPC7410RX400LE
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
32
Freescale Semiconductor
Package Description
7.5 Package Parameters for the MPC7410, 360 HCTE_LGA
The package parameters are as listed here. The package type is the 25
× 25 mm, 360 high coefficient of thermal
expansion LGA package (HCTE_LGA).
Package outline
25
× 25 mm
Interconnects
360 (19
× 19 land array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
1.92 mm
Maximum module height
2.20 mm
Coefficient of thermal expansion
12.3ppm/°C
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC7410RX400NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum
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