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參數(shù)資料
| 型號(hào)： | MPC7410RX400LE |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 33/52頁 |
| 文件大?。?/td> | 943K |
| 代理商： | MPC7410RX400LE |
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MOTOROLA
MPC7410 RISC Microprocessor Hardware Specifications
39
System Design Information
The COP interface has a standard header for connection to the target system, based on the 0.025"
square-post 0.100" centered header assembly (often called a Berg header). The connector typically has
pin 14 removed as a connector key.
There is no standardized way to number the COP header shown in Figure 23; consequently, many different
pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then
left-to-right, while others use left-to-right then top-to-bottom, while still others number the pins counter
clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in
Figure 23 is common to all known emulators.
The QACK signal shown in Figure 23 is usually connected to the PCI bridge chip in a system and is an input
to the MPC7410 informing it that it can go into the quiescent state. Under normal operation this occurs
during a low-power mode selection. In order for COP to work, the MPC7410 must see this signal asserted
(pulled down). While shown on the COP header, not all emulator products drive this signal. If the product
does not, a pull-down resistor can be populated to assert this signal. Additionally, some emulator products
implement open-drain type outputs and can only drive QACK asserted; for these tools, a pull-up resistor can
be implemented to ensure this signal is deasserted when it is not being driven by the tool. Note that the
pull-up and pull-down resistors on the QACK signal are mutually exclusive and it is never necessary to
populate both in a system. To preserve correct power-down operation, QACK should be merged via logic
so that it also can be driven by the PCI bridge.
1.8.8
Thermal Management Information
This section provides thermal management information for the MPC7410 for air-cooled applications.
Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow, and
thermal interface material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods—adhesive, spring clip to holes in the printed-circuit board or package, and
mounting clip and screw assembly; see Figure 24. This spring force should not exceed 5.5 pounds of force.
Note that care should be taken to avoid focused forces being applied to die corners and/or edges when
mounting heat sinks.
Figure 24. Package Exploded Cross-Sectional View with Several Heat Sink Options
Adhesive or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC7410RX400LD | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410RX500LC | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410HX450LE | 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410RX450LD | 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410HX400LE | 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC7410RX400NE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410RX450NE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410RX500LE | 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| MPC7410THX400LE | 功能描述:微處理器 - MPU NT HITCE RV1.4 1.8V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC7410THX400NE | 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk |
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