參數(shù)資料
型號(hào)： MPC7410HX500LE
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
文件頁(yè)數(shù)： 39/56頁(yè)
文件大?。?/td> 864K
代理商： MPC7410HX500LE
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
44
Freescale Semiconductor
System Design Information
8.8.1 Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3, the intrinsic conduction thermal resistance paths are
as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit
board.
Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air convection.
Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the silicon may
be neglected. Thus, the heat sink attach material and the heat sink conduction/convective thermal resistances are the
dominant terms.
Figure 28. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
8.8.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism, Figure 29 shows
the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare
joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal
interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the
interface thermal resistance. That is, the bare joint results in a thermal resistance approximately seven times greater
than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see Figure 26).
This spring force should not exceed 5.5 pounds of force. Therefore, the synthetic grease offers the best thermal
performance, considering the low interface pressure. Of course, the selection of any thermal interface material
depends on many factors—thermal performance requirements, manufacturability, service temperature, dielectric
properties, cost, and so on.
External Resistance
Internal Resistance
Note the internal versus external package resistance.
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
相關(guān)PDF資料
PDF描述
MPC7410THX500LE 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360
MPC7410RX400LC 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC7410RX400LD 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
MPC7410VS450LE 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
MPC7410RX400LE 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC7410HX500LE 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 500MHZ 360-FCCBGA
MPC7410RX400LE 功能描述:微處理器 - MPU REV 1.4 1.8+/-.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410RX400NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum
MPC7410RX450NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum
MPC7410RX500LE 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤
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