參數(shù)資料
型號: MPC7410HX450LE
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
文件頁數(shù): 2/56頁
文件大?。?/td> 864K
代理商: MPC7410HX450LE
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
10
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 4 provides the package thermal characteristics for the MPC7410.
Table 3. Recommended Operating Conditions 1
Characteristic
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
VDD
1.8 V ± 100 mV
V
PLL supply voltage
AVDD
1.8 V ± 100 mV
V
L2 DLL supply voltage
L2AVDD
1.8 V ± 100 mV
V
Processor bus supply
voltage
BVSEL = 0
OVDD
1.8 V ± 100 mV
V
BVSEL = HRESET
OVDD
2.5 V ± 100 mV
V
BVSEL = HRESET or
BVSEL = 1
OVDD
3.3 V ± 165 mV
V
2, 3
L2 bus supply voltage
L2VSEL = 0
L2OVDD
1.8 V ± 100 mV
V
L2VSEL = HRESET or
L2VSEL = 1
L2OVDD
2.5 V ± 100 mV
V
Input voltage
Processor bus and
JTAG signals
Vin
GND to OVDD
V—
L2 bus
Vin
GND to L2OVDD
V—
Die-junction temperature
Tj
0 to 105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions
is not guaranteed.
2. M
xx7410xxnnnLE (Rev. 1.4) and later only. Previous revisions do not support 3.3 V OVDD and have a
recommended OVDD value of 2.5 V ± 100 mV for BVSEL = 1.
3. M
xx7410xxnnnLE (Rev. 1.4) and later only. Previous revisions do not support BVSEL = HRESET.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
MPC7410
CBGA
MPC7410
HCTE
Junction-to-ambient thermal resistance, natural convection,
four-layer (2s2p) board
RθJMA
18
20
°C/W
1, 2
Junction-to-ambient thermal resistance, 1m/sec airflow,
four-layer (2s2p) board
RθJMA
14
16
°C/W
1, 2
Junction-to-ambient thermal resistance, 2m/sec airflow,
four-layer (2s2p) board
RθJMA
13
15
°C/W
1, 2
Junction-to-board thermal resistance
RθJB
911
°C/W
3
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MPC7410HX450NE 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum
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