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參數(shù)資料
| 型號： | MPC740ARX266LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 43/44頁 |
| 文件大?。?/td> | 558K |
| 代理商： | MPC740ARX266LX |
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8
MPC750A RISC Microprocessor Hardware Specications
Electrical and Thermal Characteristics
Table 4 provides the package thermal characteristics for the MPC750.
The MPC750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor,
digital-to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See
the MPC750 RISC Microprocessor User’s Manual for more information on the use of this feature.
Specications for the thermal sensor portion of the TAU are found in Table 5.
L2 bus supply voltage
L2OVdd
2.5 to 3.465
V
Input voltage
Vin
GND to OVdd
V
Die-junction temperature
Tj
0 to 105
°C
Tj
-40 to 105
°C
1
Note: These are the recommended and tested operating conditions. Proper device operation outside of
these conditions is not guaranteed.
1. For extended temperature parts marked MPC750ARXnnnTH or MPC740ARXnnnTH only (where nnn is
the operating frequency from Table 8.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
θ
JC
0.03
°C/W
CBGA package thermal resistance, die junction-to-lead thermal resistance (typical)
θ
JB
3.8
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
Table 5. Thermal Sensor Specifications
At recommended operating conditions (See Table 3)
Num
Characteristic
Min
Max
Unit
Notes
1
Temperature range
0
127
°C
1
2
Comparator settling time
20
—
s
2
3
Resolution
4
—
°C
3
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an
absolute temperature, but it must be interpreted by software to derive the absolute junction temperature. For
information about the use and calibration of the TAU, see Motorola Application Note AN1800/D, “Programming
the Thermal Assist Unit in the MPC750 Microprocessor”.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into
the THRM3 SPR.
3. Guaranteed by design and characterization.
Table 3. Recommended Operating Conditions (Continued)
Characteristic
Symbol
MPC750A Value
Unit
Notes
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