參數(shù)資料
型號(hào)： MPC603RZT266LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, PBGA255
封裝： 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁(yè)數(shù)： 33/36頁(yè)
文件大小： 440K
代理商： MPC603RZT266LX
6
PID7t-603e Hardware Specifications
Electrical and Thermal Characteristics
Table 4 provides the package thermal characteristics for the PID7t-603e.
Table 5 provides the DC electrical characteristics for the PID7t-603e.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
CBGA
Value
PBGA
Rating
Package die junction-to-case thermal resistance (typical)
qJC
0.095
8.0
°C/W
Package die junction-to-ball thermal resistance (typical)
qJB
3.5
13
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
Table 5. DC Electrical Specifications
Vdd = AVdd = 2.5 ± 5% V dc, OVdd = 3.3 ± 5% V dc, GND = 0 V dc, 0
Tj 105 °C
Characteristic
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
VIH
2.0
5.5
V
Input low voltage (all inputs except SYSCLK)
VIL
GND
0.8
V
SYSCLK input high voltage
CVIH
2.4
5.5
V
SYSCLK input low voltage
CVIL
GND
0.4
V
Input leakage current, Vin = 3.465 V
Iin
—
30
A
1,2
Vin = 5.5 V
Iin
—
300
A
1,2
Hi-Z (off-state) leakage current, Vin = 3.465 V
ITSI
—
30
A
1,2
Vin = 5.5 V
ITSI
—
300
A
1,2
Output high voltage, IOH = 7 mA
VOH
2.4
—
V
Output low voltage, IOL = 7 mA
VOL
—
0.4
V
Capacitance, Vin = 0 V, f = 1 MHz (excludes TS, ABB, DBB, and
ARTRY)
Cin
—
10.0
pF
3
Capacitance, Vin = 0 V, f = 1 MHz (for TS, ABB, DBB, and ARTRY)Cin
—
15.0
pF
3
Notes:
1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK, and JTAG signals).
2. The leakage is measured for nominal OVdd and Vdd or both OVdd and Vdd must vary in the same direction
(for example, both OVdd and Vdd vary by either +5% or -5%).
3. Capacitance is periodically sampled rather than 100% tested.
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