參數(shù)資料
型號： MPC603PFE240LX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 240 MHz, RISC PROCESSOR, CQFP240
封裝： 32 X 32 MM, 4.10 MM HEIGHT, 0.50 MM PITCH, CERAMIC, QFP-240
文件頁數(shù)： 26/40頁
文件大?。?/td> 431K
代理商： MPC603PFE240LX
32
PID7v-603e Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Figure 15. Motorola CQFP Thermal Management Example
The junction temperature can be calculated from the junction-to-ambient thermal resistance, as follows:
Junction temperature:
Tj = Ta + Rθja * P
or
Tj = Ta + (Rθjc + Rcs + Rsa) * P
Where:
Ta is the ambient temperature in the vicinity of the device
Rθja is the junction-to-ambient thermal resistance
Rθjc is the junction-to-case thermal resistance of the device
Rcs is the case-to-heat sink thermal resistance of the interface material
Rsa is the heat sink-to-ambient thermal resistance
P is the power dissipated by the device
In this environment, it can be assumed that all the heat is dissipated to the ambient through the heat sink, so
the junction-to-ambient thermal resistance is the sum of the resistances from the junction to the case, from
the case to the heat sink, and from the heat sink to the ambient.
Note that verication of external thermal resistance and case temperature should be performed for each
application. Thermal resistance can vary considerably due to many factors including degree of air
turbulence.
For a power dissipation of 2.5 Watts in an ambient temperature of 40
°C at 1 m/sec with the heat sink
measured above, the junction temperature of the device would be as follows:
Tj = Ta + Rθja * P
Tj = 40 °C + (10 °C/Watt * 2.5 Watts) = 65 °C
which is well within the reliability limits of the device.
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Motorola Wire-Bond CQFP
With Heat Sink
Forced Convection (m/sec)
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Ther
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Resistance
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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