參數(shù)資料
型號: MPC603PFE180LX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 180 MHz, RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 4.10 MM HEIGHT, 0.50 MM PITCH, CERAMIC, QFP-240
文件頁數(shù): 30/40頁
文件大?。?/td> 431K
代理商: MPC603PFE180LX
36
PID7v-603e Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Figure 17. CBGA Thermal Management Example
Temperature calculations are also performed identically to those in the previous section. For a power
dissipation of 2.5 Watts in an ambient of 40
° C at 1.0 m/sec, the associated overall thermal resistance and
junction temperature, found in Table 13, will result.
Vendors such as Aavid Engineering Inc., Thermalloy, and Wakeeld Engineering can supply heat sinks with
a wide range of thermal performance. Refer to Section 1.8.6.1.2, “Thermal Management Example,” for
contact information.
Table 13. Thermal Resistance and Junction Temperature
Conguration
θja (°C/W)
Tj (
°C)
Exposed die (no heat sink)
18.4
86
With 2338 heat sink
5.3
53
Approach Air Velocity (m/sec)
0
5
10
15
20
01
2
3
4
θ ja
(°C/W)
IBM CBGA with Exposed Die
25
5
IBM CBGA with Thermalloy
2338B-Pin Fin Heat Sink
Assumptions:
1. 2P card with 1 OZ Cu planes
2. 63 mm x 76 mm card
3. Air flow on both sides of card
4. Vertical orientation
5. 2-stage epoxy heat sink attach
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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