參數(shù)資料
      

      


      


      
型號(hào)：
MPC603EFE100TX

      

      
廠商：
MOTOROLA INC

      

      
元件分類：
微控制器/微處理器

      

      
英文描述：
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240

      

      
封裝：
32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240

      

      
文件頁(yè)數(shù)：
24/32頁(yè)

      

      
文件大?。?/td>
149K

      

      
代理商：
MPC603EFE100TX


      

      

      

	
      
    
    

    
      
	
      30
      PID6-603e Hardware Specifications, Rev 2
      Figure 17. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
      Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 °C/W, thus
      Tj = 30°C + 5°C + (2.2 °C/W +1.0 °C/W + 7 °C/W) * 4.5 W,
      resulting in a die-junction temperature of approximately 81 °C which is well within the maximum operating
      temperature of the component.
      Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakeeld Engineering, and Aavid
      Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
      Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
      gure-of-merit used for comparing the thermal performance of various microelectronic packaging
      technologies, one should exercise caution when only using this metric in determining thermal management
      because no single parameter can adequately describe three-dimensional heat ow. The nal die-junction
      operating temperature, is not only a function of the component-level thermal resistance, but the system-level
      design and its operating conditions. In addition to the component's power consumption, a number of factors
      affect the nal operating die-junction temperature—airow, board population (local heat ux of adjacent
      components), heat sink efciency, heat sink attach, heat sink placement, next-level interconnect technology,
      system air temperature rise, altitude, etc.
      Due to the complexity and the many variations of system-level boundary conditions for today's
      microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection and
      conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for
      the board, as well as, system-level designs. To expedite system-level thermal analysis, several “compact”
      thermal-package models are available within FLOTHERM. These are available upon request.
      1
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      4
      5
      6
      7
      8
      0
      0.5
      1
      1.5
      2
      2.5
      3
      3.5
      Thermalloy #2328B Pin-fin Heat Sink
      (25 x 28 x 15 mm)
      Heat
      Sink
      Thermal
      Resistance
      (
      °C/W)
      Approach Airflow Velocity
      (m/s)
      Approach Airflow Velocity (m/s)
      Heat
      Sink
      Thermal
      Resistance
      (°C/W)
      
    
      
    
    
      


      


      

      相關(guān)PDF資料
      		

      PDF描述
      		

      
      

      
MPC603EFE133LX
32-BIT, 133 MHz, RISC PROCESSOR, CQFP240

      

      
MPC603EFE100LX
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240

      

      
MPC604AFX120
32-BIT, 120 MHz, RISC PROCESSOR, CQFP304

      

      
MPC7410RX500LX
32-BIT, 500 MHz, RISC PROCESSOR, CBGA360

      

      
MPC7410RX450LX
32-BIT, 450 MHz, RISC PROCESSOR, CBGA360

      

      

      

      


      


      

      相關(guān)代理商/技術(shù)參數(shù)
      		

      參數(shù)描述
      		

      
      

      
MPC603EFE133LN
 制造商:Motorola Inc 功能描述:

      

      
MPC603EFE133TN
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications

      

      
MPC603ERX100LN
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications

      

      
MPC603ERX100TN
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications

      

      
MPC603ERX133LN
 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications

      

      
    
    
    
	
      	
    
    
     
     
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