參數資料
型號: MPC603AFE66CC
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: RISC PROCESSOR, CQFP240
封裝: 32 X 32 MM, 3.10 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
文件頁數: 10/31頁
文件大?。?/td> 120K
代理商: MPC603AFE66CC
18
603 Hardware Specifications
1.7.1.2 Mechanical Dimensions of the Motorola Wire-Bond CQFP Package
Figure 10 shows the mechanical dimensions for the Motorola wire-bond CQFP package.
Figure 10. Mechanical Dimensions of the Motorola Wire-Bond CQFP Package
*Reduced pin count shown for clarity. 60 pins per side
Min.
Max.
A
30.86
31.75
B
34.6 BSC
C
3.75
4.15
D
0.5 BSC
E
0.18
0.30
F
3.10
3.90
G
0.13
0.175
H
0.45
0.55
J
0.25
AA
1.80 REF
AB
0.95 REF
θ12°
6
°
θ21°
7
°
R
0.15 REF
–H–
AB
θI
R
AA
θ2
H
Pin 240
C
A
B
Pin 1
DE
*Not to scale
G
F
J
Die
Wire Bonds
Ceramic Body
Alloy 42 Leads
Notes:
1. BSC—Between Standard Centers.
2. All measurements in mm.
相關PDF資料
PDF描述
MPC603AIP200E 32-BIT, 200 MHz, RISC PROCESSOR, CPGA288
MPC603CIP200D 32-BIT, 200 MHz, RISC PROCESSOR, CPGA288
MPC603DIM266E 32-BIT, 266 MHz, RISC PROCESSOR, CPGA288
MPC603FIM300E 32-BIT, 300 MHz, RISC PROCESSOR, CPGA288
MPC603ERC200D 32-BIT, 200 MHz, RISC PROCESSOR, CPGA288
相關代理商/技術參數
參數描述
MPC603AFE80CB 制造商:Motorola Inc 功能描述:
MPC603E 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor
MPC603E7TEC 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor
MPC603E7TED 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor
mpc603efe100ln 制造商: 功能描述: 制造商:undefined 功能描述: