參數資料
型號： MPC5604PEF0MLQ4
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-144
文件頁數： 41/99頁
文件大?。?/td> 1130K
代理商： MPC5604PEF0MLQ4
MPC5604P Microcontroller Data Sheet, Rev. 7
Freescale Semiconductor
46
3.5.2
General notes for specifications at maximum junction temperature
An estimation of the chip junction temperature, TJ, can be obtained from Equation 1:
TJ = TA + (RJA * PD)
Eqn. 1
where:
TA
= ambient temperature for the package (°C)
RJA
= junction to ambient thermal resistance (°C/W)
PD
= power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed in Equation 2 as the sum of a junction to case thermal resistance
and a case to ambient thermal resistance:
RJA = RJC + RCA
Eqn. 2
where:
5 Thermal characterization parameter indicating the temperature difference between the case and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JC.
Table 11. Thermal characteristics for 100-pin LQFP
Symbol
Parameter
Conditions
Typical value Unit
RJA
Thermal resistance junction-to-ambient,
natural convection1
1 Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board
meets JEDEC specification for this package.
Single layer board—1s
47.3
°C/W
Four layer board—2s2p
35.3
°C/W
RJB
Thermal resistance junction-to-board2
2 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets
JEDEC specification for the specified package.
Four layer board—2s2p
19.1
°C/W
RJCtop Thermal resistance junction-to-case (top)
3
3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold
plate temperature is used for the case temperature. Reported value includes the thermal resistance
of the interface layer.
Single layer board—1s
9.7
°C/W
JB
Junction-to-board, natural convection4
4 Thermal characterization parameter indicating the temperature difference between the board and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JB.
Operating conditions
19.1
°C/W
JC
Junction-to-case, natural convection5
5 Thermal characterization parameter indicating the temperature difference between the case and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JC.
Operating conditions
0.8
°C/W
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