參數(shù)資料
型號(hào)： MPC5602DF1VLH3
廠商： FREESCALE SEMICONDUCTOR INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP64
封裝： 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MS-026BCD, LQFP-64
文件頁(yè)數(shù)： 19/83頁(yè)
文件大?。?/td> 1473K
代理商： MPC5602DF1VLH3
MPC5602D Microcontroller Data Sheet, Rev. 4
Preliminary—Subject to Change Without Notice
Electrical characteristics
Freescale Semiconductor
26
4.6
Thermal characteristics
4.6.1
Package thermal characteristics
4.6.2
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:
TJ = TA + (PD x RJA)
Eqn. 1
Table 13. LQFP thermal characteristics1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol C
Parameter
Conditions2
2 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = –40 to 125 °C
Value3
3 All values need to be confirmed during device validation.
Unit
RJA CC D Thermal resistance, junction-to-ambient natural
convection4
4 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-7. Thermal test board
meets JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA.
Single-layer board —1s
LQFP64
72.1
°C/W
LQFP100
65.2
Four-layer board — 2s2p LQFP64
57.3
LQFP100
51.8
RJB CC D Thermal resistance, junction-to-board
5
5 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package. When Greek letters are not available, the symbols are typed as RthJB.
Four-layer board — 2s2p LQFP64
44.1
°C/W
LQFP100
41.3
RJC CC D Thermal resistance, junction-to-case
6
6 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
When Greek letters are not available, the symbols are typed as RthJC.
Single-layer board — 1s
LQFP64
26.5
°C/W
LQFP100
23.9
Four-layer board — 2s2p LQFP64
26.2
LQFP100
23.7
JB
CC D Junction-to-board thermal characterization
parameter, natural convection
Single-layer board — 1s
LQFP64
41
°C/W
LQFP100
41.6
Four-layer board — 2s2p LQFP64
43
LQFP100
43.4
JC
CC D Junction-to-case thermal characterization
parameter, natural convection
Single-layer board — 1s
LQFP64
11.5
°C/W
LQFP100
10.4
Four-layer board — 2s2p LQFP64
11.1
LQFP100
10.2
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