參數(shù)資料
型號: MPC5566MVR80
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 80 MHz, MICROCONTROLLER, PBGA416
封裝: 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416
文件頁數(shù): 53/66頁
文件大?。?/td> 1351K
代理商: MPC5566MVR80
Revision History for the MPC5566 Data Sheet
MPC5566 Microcontroller Data Sheet, Rev. 2.0
Freescale Semiconductor
57
Table 1, Orderable Part Numbers:
Added a 144 MHz system frequency option for:
MPC5566MVR144, Pb-Free (lead free), nominal 144, maximum 147
MPC5566MZP144, SnPb (leaded), nominal 144, maximum 147
Changed the 132 MHz maximum operating frequency to 135 MHz.
Reordered rows to group devices by lead-free package types in descending frequency order, and leaded
package types.
Footnote 1 added that reads: All devices are PPC5566, rather than MPC5566 or SPC5566, until product
qualifications are complete. Not all configurations are available in the PPC parts.
Footnote 2 added that reads: The lowest ambient operating temperature is referenced by TL; the highest ambient
operating temperature is referenced by TH.
Changed footnote 3 from ‘132 MHz allows only 128 MHz + 2% FM’ to ‘135 MHz parts allow for 132 MHz systems
clock + 2% FM’; and added ‘147 MHz parts allow for 144 MHz systems clock + 2% FM.
Table 2, Absolute Maximum Ratings:
Deleted Spec 3, “Flash core voltage.”
Spec 12 “DC Input Voltage”: Deleted from second line‘. . .except for eTPUB15 and SINB (DSPI_B_SIN)’ leaving
VDDEH powered I/O pads. Deleted third line ‘VDDEH powered by I/O pads (eTPUB15 and SINB), including the
min. and max values of -0.3 and 6.5 respectively, and deleted old footnote 7.
Spec 12 “DC Input Voltage”: Added footnote 8 to second line “VDDE powered I/O pads” that reads: ‘Internal
structures hold the input voltage less than the maximum voltage on all pads powered by the VDDE supplies, if the
maximum injection current specification is met (s mA for all pins) and VDDE is within the operating voltage
specifications.
Spec 14, column 2, changed: ‘VSS differential voltage’ to ‘VSS to VSSA differential voltage.’
Spec 15, column 2, changed: ‘VDD differential voltage’ to ‘VDD to VDDA differential voltage.’
Spec 21, Added the name of the spec, ‘VRC33 to VDDSYN differential voltage,’ as well as the name and cross
reference to Table 9, DC Electrical Specifications, to which the Spec was moved.
Spec 28 “Maximum Solder Temperature”: Added two subordinate lines:
Lead free (PbFree) and Leaded (SnPb) with maximum values of 260 C and 245 C respectively.
Footnote 1, added: ‘a(chǎn)ny of’ between ‘beyond’ and ‘the listed maxima.’
Deleted footnote 2: ‘Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum
specifications for device stress have not yet been determined.’Spec 26 “Maximum Operating Temperature
Range”: replaced -40 C with TL.
Footnote 6 (now footnote 5): Changed to the following sentence to the end, “Internal structures hold the input
voltage greater than -1.0 V if the injection current limit of 2 mA is met. Keep the negative DC voltage greater than
-0.6 V on eTPU[15] and on SINB during the internal power-on reset (POR) state.”
Table 4, EMI Testing Specifications:
Changed the maximum operating frequency to from 132 to fMAX.
Footnote 2: Deleted ‘Refer to Table 1 for the maximum operating frequency.’
Table 33. Table and Figure Changes Between Rev. 0.0 and Rev. 1.0 (continued)
Location
Description of Changes
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC551x
and
MPC5533
products
in
208
MAPBGA
packages;
MPC5534
and
MPC5553
products
in
208
and
496
MAPBGA
packages;
MPC5554,
MPC5565,
MPC5566
and
MPC5567
products
in
496
MAPBGA
packages
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