參數(shù)資料
型號(hào)： MPC5553MZQ112
廠商： FREESCALE SEMICONDUCTOR INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 112 MHz, MICROCONTROLLER, PBGA324
封裝： 23 X 23 MM, 1 MM PITCH, PLASTIC, MS-034AAJ-1, BGA-324
文件頁(yè)數(shù)： 56/68頁(yè)
文件大?。?/td> 1261K
代理商： MPC5553MZQ112
MPC5553 Microcontroller Data Sheet, Rev. 3.0
Electrical Characteristics
Freescale Semiconductor
6
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J
, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature for the package (
oC)
RθJA = junction to ambient thermal resistance (
oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Table 3. MPC5553 Thermal Characteristics
Spec
MPC5553 Thermal Characteristic
Symbol
Packages
Unit
208
MAPBGA
324
PBGA
416
PBGA
1
Junction to ambient, natural convection (one-layer board) 1, 2
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
RθJA
41
30
29
°C/W
2
Junction to ambient, natural convection 1, 3
(four-layer board 2s2p)
3 Per JEDEC JESD51-6 with the board horizontal.
RθJA
25
21
°C/W
3
Junction to ambient (@200 ft./min., one-layer board)
RθJMA
33
24
23
°C/W
4
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RθJMA
22
17
18
°C/W
5
Junction to board (four-layer board 2s2p) 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RθJB
15
12
13
°C/W
6
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RθJC
78
9
°C/W
7
Junction to package top, natural convection 6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Ψ
JT
22
2
°C/W
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC551x
and
MPC5533
products
in
208
MAPBGA
packages;
MPC5534
and
MPC5553
products
in
208
and
496
MAPBGA
packages;
MPC5554,
MPC5565,
MPC5566
and
MPC5567
products
in
496
MAPBGA
packages
相關(guān)PDF資料
PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC5553MZQ112R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
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MPC5553MZQ80 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller Data Sheet
MPC5553MZQ80R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
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