參數(shù)資料
型號： MPC5534MZQ40
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： MICROCONTROLLER, PBGA324
封裝： 23 X 23 MM, 1 MM PITCH, PLASTIC, MS-034AAJ-1, BGA-324
文件頁數(shù)： 58/60頁
文件大?。?/td> 1055K
代理商： MPC5534MZQ40
Electrical Characteristics
MPC5534 Microcontroller Data Sheet, Rev. 5
Freescale Semiconductor
7
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB PD)
where:
TJ = junction temperature (
oC)
TB = board temperature at the package perimeter (
oC/W)
RJB = junction-to-board thermal resistance (
oC/W) per JESD51-8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an acceptable value
for the junction temperature is predictable. Ensure the application board is similar to the thermal test
condition, with the component soldered to a board with internal planes.
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a
case-to-ambient thermal resistance:
RJA = RJC + RCA
where:
RJA = junction-to-ambient thermal resistance (
oC/W)
RJC = junction-to-case thermal resistance (
oC/W)
RCA = case-to-ambient thermal resistance (
oC/W)
RJC is device related and is not affected by other factors. The thermal environment can be controlled to
change the case-to-ambient thermal resistance, RCA. For example, change the air flow around the device,
add a heat sink, change the mounting arrangement on the printed circuit board, or change the thermal
dissipation on the printed circuit board surrounding the device. This description is most useful for
packages with heat sinks where 90% of the heat flow is through the case to heat sink to ambient.
For most packages, a better model is required.
A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal
resistance and the junction-to-case thermal resistance. The junction-to-case thermal resistance describes
when using a heat sink or where a substantial amount of heat is dissipated from the top of the package. The
junction-to-board thermal resistance describes the thermal performance when most of the heat is
conducted to the printed circuit board. This model can be used to generate simple estimations and for
computational fluid dynamics (CFD) thermal models.
To determine the junction temperature of the device in the application on a prototype board, use the
thermal characterization parameter (
JT) to determine the junction temperature by measuring the
temperature at the top center of the package case using the following equation:
TJ = TT + (JT PD)
where:
TT = thermocouple temperature on top of the package (
oC)
JT = thermal characterization parameter (
oC/W)
PD = power dissipation in the package (W)
相關(guān)PDF資料
PDF描述
MPC5534MZQ66 MICROCONTROLLER, PBGA324
MPC5534MZQ80 FLASH, 80 MHz, MICROCONTROLLER, PBGA324
MPC5534MVF40 MICROCONTROLLER, PBGA208
MPC5553MVR132 32-BIT, FLASH, 132 MHz, MICROCONTROLLER, PBGA416
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC5534MZQ40R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5534MZQ66 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5534MZQ66R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5534MZQ80 功能描述:32位微控制器 - MCU 1MB FLASH POWERPC Z3 COR RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MPC5534MZQ80R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
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