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參數(shù)資料
| 型號(hào)： | MP03XXX275-20 |
| 廠商： | Dynex Semiconductor Ltd. |
| 英文描述： | Phase Control Dual SCR, SCR/Diode Modules |
| 中文描述： | 相位控制雙可控硅，SCR /二極管模塊 |
| 文件頁(yè)數(shù)： | 3/10頁(yè) |
| 文件大?。?/td> | 127K |
| 代理商： | MP03XXX275-20 |
3/10
MP03 XXX 275 Series
Part number is made up of as follows:
MP03 HBT 275 - 20
MP
03
HBT = Circuit configuration code (see "circuit options" - front page)
275
= Nominal average current rating at T
case
= 75
o
C
20
= V
RRM
/100
= Pressure contact module
= Outline type
NOTE: Diode ratings and characteristics are comparable with the SCR in types HBP or HBN
Types HBP or HBN can also be supplied with diode polarity reversed, to special order.
Gate non-trigger voltage
V
3.0
0.25
mA
V
V
GD
Gate trigger voltage
150
V
GT
I
GT
Gate trigger current
At V
DRM
T
case
= 25
o
C
V
DRM
= 5V, T
case
= 25
o
C
V
DRM
= 5V, T
case
= 25
o
C
-
-
-
V
30
0.25
V
V
RGM
Peak reverse gate voltage
V
5.0
-
A
-
-
-
10
I
FGM
Peak forward gate current
Peak forward gate voltage
V
FGM
V
FGN
Peak forward gate voltage
Anode positive with respect to cathode
Anode negative with respect to cathode
Anode positive with respect to cathode
P
GM
P
G(AV)
Peak gate power
Mean gate power
t
p
= 25
μ
s
-
-
100
5
W
W
I
Adequate heatsinking is required to maintain the base temperature
at 75
o
C if full rated current is to be achieved. Power dissipation may
be calculated by use of V
and r
information in accordance with
standard formulae. We can provide assistance with calculations or
choice of heatsink if required.
I
The heatsink surface must be smooth and flat; a surface finish
of N6 (32
μ
in) and a flatness within 0.05mm (0.002") are
recommended.
I
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build up
and foreign material. Care should be taken to ensure no foreign
particles remain.
I
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces. This
should ideally be 0.05mm (0.002") per surface to ensure optimum
thermal performance.
I
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the heatsink.
Using a torque wrench, slowly tighten the recommended fixing
bolts at each end, rotating each in turn no more than 1/4 of a
revolution at a time. Continue until the required torque of 5Nm
(44lb.ins) is reached at both ends.
I
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
Examples:
MP03 HBP275-16
MP03 HBN275-22
MP03 HBT275-18
ORDERING INSTRUCTIONS
MOUNTING RECOMMENDATIONS
Symbol
Parameter
Conditions
Units
Max.
Typ.
GATE TRIGGER CHARACTERISTICS AND RATINGS
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MP03XXX275 | Phase Control Dual SCR, SCR/Diode Modules |
| MP03XXX300 | Phase Control Dual SCR, SCR/Diode Modules |
| MP03XXX330-08 | Phase Control Dual SCR, SCR/Diode Modules |
| MP03XXX330-10 | Phase Control Dual SCR, SCR/Diode Modules |
| MP03XXX330-12 | Phase Control Dual SCR, SCR/Diode Modules |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MP03XXX275-22 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03XXX300 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03XXX330 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03XXX330-08 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
| MP03XXX330-10 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Phase Control Dual SCR, SCR/Diode Modules |
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