
Features
l
Planar Die construction
l
200mW Power Dissipation
l
Zener Voltages from 2.4V - 39V
l
Ideally Suited for Automated Assembly Processes
Mechanical Data
l
Case: SOD-323 Molded Plastic
l
Terminals: Solderable per MIL-STD-202, Method 208
l
Approx. Weight: 0.008 gram
l
Mounting Position: Any
l
Storage & Operating Junction Temperature: -55
o
C to +150
o
C
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Zener Current
Maximum Forward
Voltage
Power Dissipation
(Notes A)
Peak Forward Surge
I
FSM
2.0
Current (Notes B)
I
F
V
F
100
mA
1.2
V
P
(AV)
200
mWatt
Amps
NOTES:
MMXZ5221B
THRU
MMXZ5259B
200 mW
Zener Diodes
2.4 to 39 Volts
M C C
www.
mc c semi
.c om
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or equivalent
square wave, duty cycle = 4 pulses per minute maximum
.
INCHES
MIN
.090
.068
.045
.027
.009
.002
.012
MM
DIM
MAX
.107
.078
.054
.038
.014
.006
---
MIN
2.30
1.75
1.15
0.70
0.25
0.05
0.30
MAX
2.70
1.95
1.35
0.95
0.35
0.15
---
NOTE
A
B
C
D
E
F
G
SOD323
0.
031
”
0.0
59
"
0.0
39
”
SUGGESTED SOLDER
PAD LAYOUT
A
B
E
C
D
F
G
DIMENSIONS
omp
onents
21201 Itasca Street Chatsworth
!
"#
"#
$ %
!