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參數(shù)資料
| 型號(hào)： | MM9329-2700TB2 |
| 廠商： | MURATA MANUFACTURING CO LTD |
| 元件分類： | RF連接器 |
| 英文描述： | BOARD TERMINATED, FEMALE, RF CONNECTOR, SURFACE MOUNT, RECEPTACLE |
| 文件頁數(shù)： | 3/3頁 |
| 文件大?。?/td> | 157K |
| 代理商： | MM9329-2700TB2 |
CG01-J
317
5.33
18
GSC - Contact
SMA - Jack
5.33
6.5
4.06
5.08
5.33
13.4
GSC - Female
SMA - Jack
4.6
5.33
3
5.08
5.33
13.4
GSC – Male
SMA - Jack
2.
1
5.08
8.55
0.85
2.5
5
2
2.3
7.95
4.4
2.1
7.4
7.95
± 2
2.3
± 0.6
Dia.
8
3.9
± 0.6
35
± 2
45
± 2
HIGH FREQUENCY DEVICES
COAXIAL CONNECTORS
SMT, MICROMINIATURE
GSC Series
APPLICATION NOTES
I PCB mounting pattern dimensions: Dimensions shown
on page 319 “Recommended Mounting Dimensions”
should be used for PCB design.
I Disengagement and engagement:
Use tool P/N M22001. The connector to be disengaged
and engaged should be pulled out or insert to the vertical
direction using the tool. Do not try and pull out the cable
by hand or wire breakage may result.
I Cable and connector handling: Do not apply a twisting
torque to the cable and connector.
I REFLOW SOLDERING CONDITION: Reflow soldering
should be carried out according to condition shown
in Fig. 3.
DISENGAGEMENT TOOL (Fig. 1): mm
M22001
SMA-GSC ADAPTERS (Fig. 2): mm
MM121471
STANDARD REFLOW SOLDERING
CONDITIONS (Fig. 3)
MM121470
MM121480
How to use disengagement tool
30
60
90
120
150
180
Allowable temperature and time of reflow soldering
T
emperature
(°C)
260
250
240
230
220
210
200
190
180
Time [sec.]
Solder : Sn60%– Pb40%
Pre-heating 150 ± 10°C
60 ~ 120 sec.
20 ~ 30 sec. max.
10 sec. max.
Peak temperature 225 ± 5°C
T
e
mperature
(°C)
220
200
150
100
25
0
Time [sec.]
Measuring point of temperature in-out terminals of the device.
Reflow Soldering
Hot air
Both convection and infrared rays
Hot plate
HIGH
FREQUENC
Y
DEVICES
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