參數(shù)資料
型號(hào)： MM908E625ACDWB/R2
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PDSO54
封裝： PLASTIC, SOIC-54
文件頁(yè)數(shù)： 31/40頁(yè)
文件大?。?/td> 595K
代理商： MM908E625ACDWB/R2
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
908E625
37
RUN Mode
During RUN mode the main voltage regulator is on. It
provides a regulated supply to all digital sections.
STOP Mode
During STOP mode the STOP mode regulator supplies a
regulated output voltage. The STOP mode regulator has a very
limited output current capability. The output voltage will be
lower than the output voltage of the main voltage regulator.
FACTORY TRIMMING AND CALIBRATION
To enhance the ease-of-use of the 908E625, various
parameters (e.g. ICG trim value) are stored in the flash memory
of the device. The following flash memory locations are
reserved for this purpose and might have a value different from
the “empty” (0xFF) state:
0xFD800xFDDF Trim and Calibration Values
0xFFFE:0xFFFF Reset Vector
In the event the application uses these parameters, one has
to take care not to erase or override these values. If these
parameters are not used, these flash locations can be erased
and otherwise used.
PACKAGE THERMAL PERFORMANCE
Figure 21 shows a thermal response curve for a package
mounted onto a thermally enhanced PCB.
Note The PCB board is a multi-layer with two inner copper
planes (2s2p). The board conforms to JEDEC EIA/JESD 51-5
and JESD51-7. Substrate thickness is 1.60 mm. Top and
bottom copper trace layers are 0.7 mm thick, with two inner
copper planes of 0.35 mm thickness. Thermal vias have
0.35 mm thick plating.
Figure 21. Thermal Response of H-Bridge Driver with Package Soldered to a JEDEC PCB Board
0
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0.00001 0.0001
0.001
0.01
0.1
1
10
100
1000
10000
time[s]
Thermal
Impedance
[
C
/W]
Time (s)
Th
er
mal
Impe
dan
ce
(°C/W)
1.0
5.0
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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