參數(shù)資料
型號(hào)： MM908E624ACEW
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 8-BIT, FLASH, 32 MHz, MICROCONTROLLER, PDSO54
封裝： 0.65 MM PITCH, ROHS COMPLIANT, SOIC-54
文件頁數(shù)： 3/39頁
文件大小： 702K
代理商： MM908E624ACEW
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
908E624
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
All characteristics are for the analog chip only. Please refer to the 68HC908EY16 data sheet for characteristics of the
microcontroller chip. Characteristics noted under conditions 9.0 V ≤ VSUP ≤ 16 V, -40 °C ≤ TJ ≤ 125 °C, unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
LIN PHYSICAL LAYER
Driver Characteristics for Normal Slew Rate (19), (20)
Dominant Propagation Delay TXD to LIN
tDOM-MIN
——
50
μs
Dominant Propagation Delay TXD to LIN
tDOM-MAX
——
50
μs
Recessive Propagation Delay TXD to LIN
tREC-MIN
——
50
μs
Recessive Propagation Delay TXD to LIN
tREC-MAX
——
50
μs
Propagation Delay Symmetry: tDOM-MIN - tREC-MAX
DT1
-10.44
—
μs
Propagation Delay Symmetry: tDOM-MAX - tREC-MIN
DT2
—
11
μs
Driver Characteristics for Slow Slew Rate (19), (21)
Dominant Propagation Delay TXD to LIN
tDOM-MIN
—
100
μs
Dominant Propagation Delay TXD to LIN
tDOM-MAX
—
100
μs
Recessive Propagation Delay TXD to LIN
tREC-MIN
—
100
μs
Recessive Propagation Delay TXD to LIN
tREC-MAX
—
100
μs
Propagation Delay Symmetry: tDOM-MIN - tREC-MAX
DT1S
-22
—
μs
Propagation Delay Symmetry: tDOM-MAX - tREC-MIN
DT2S
—
23
μs
Driver Characteristics for Fast Slew Rate
LIN High Slew Rate (Programming Mode)
SRFAST
—15
—
V/
μs
Receiver Characteristics and Wake-Up Timings
Receiver Dominant Propagation Delay (22)
tRL
—3.5
6.0
μs
Receiver Recessive Propagation Delay (22)
tRH
—3.5
6.0
μs
Receiver Propagation Delay Symmetry
tR-SYM
-2.0
—
2.0
μs
Bus Wake-up Deglitcher
tPROPWL
35
—
150
μs
Bus Wake-up Event Reported (23)
tWAKE
—20
—
μs
Notes
19.
VSUP from 7.0 V to 18 V, bus load R0 and C0 1.0 nF/1.0 kΩ, 6.8 nF/660 Ω, 10 nF/500 Ω. Measurement thresholds: 50% of TXD signal
to LIN signal threshold defined at each parameter.
20.
21.
22.
Measured between LIN signal threshold VIL or VIH and 50% of RXD signal.
23.
tWAKE is typically 2 internal clock cycles after LIN rising edge detected. See Figure 8 and Figure 9, page 15. In Sleep mode the VDD
rise time is strongly dependent upon the decoupling capacitor at VDD pin.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MM908E624ACEW/R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Triple High Side Switch with Embedded MCU and LIN Serial Communicationfor Relay Drivers
MM908E624ACEWR2 功能描述:電源開關(guān) IC - 配電 TRIPLE HIGH SIDE DRIVER RoHS:否 制造商:Exar 輸出端數(shù)量:1 開啟電阻（最大值）:85 mOhms 開啟時(shí)間（最大值）:400 us 關(guān)閉時(shí)間（最大值）:20 us 工作電源電壓:3.2 V to 6.5 V 電源電流（最大值）: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-23-5
MM908E624ACPEW 功能描述:8位微控制器 -MCU 3 HIGH SIDE SWITCH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MM908E624ACPEWR2 功能描述:8位微控制器 -MCU 3 HIGH SIDE DRIVER RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MM908E624AYEW 功能描述:開關(guān) IC - 各種 TRIPLE HIGH SIDE SWITCH RoHS:否 制造商:Fairchild Semiconductor 開啟電阻（最大值）: 電源電壓-最大:4.4 V 電源電壓-最小:2.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:WLCSP-9 封裝:Reel
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