參數(shù)資料
型號(hào): MM74HC74AMX
廠商: Fairchild Semiconductor
文件頁(yè)數(shù): 11/11頁(yè)
文件大?。?/td> 0K
描述: IC FLIP FLOP DUAL D 14-SOIC
標(biāo)準(zhǔn)包裝: 1
系列: 74HC
功能: 設(shè)置(預(yù)設(shè))和復(fù)位
類型: D 型
輸出類型: 差分
元件數(shù): 2
每個(gè)元件的位元數(shù): 1
頻率 - 時(shí)鐘: 72MHz
延遲時(shí)間 - 傳輸: 12ns
觸發(fā)器類型: 正邊沿
輸出電流高,低: 5.2mA,5.2mA
電源電壓: 2 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 1208 (CN2011-ZH PDF)
其它名稱: MM74HC74AMXDKR
1983 Fairchild Semiconductor Corporation
www.fairchildsemi.com
MM74HC74A Rev. 1.3.0
9
MM74HC74A
Dual
D-T
ype
Flip-Flop
with
Preset
and
Clear
Physical Dimensions (Continued)
Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specications do not expand the terms of Fairchild’s worldwide terms and conditions,
specically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
F. DRAWING FILE NAME: MTC14REV6
R0.09 min
12.00°
TOP & BOTTOM
0.43 TYP
1.00
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
R0.09min
E. LANDPATTERN STANDARD: SOP65P640X110-14M
0.65
6.10
1.65
0.45
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
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