參數(shù)資料
型號(hào): MM74HC125MX
廠商: Fairchild Semiconductor
文件頁(yè)數(shù): 7/10頁(yè)
文件大小: 0K
描述: IC BUFF TRI-ST QD N-INV 14SOIC
標(biāo)準(zhǔn)包裝: 1
系列: 74HC
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相
元件數(shù): 4
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 7.8mA,7.8mA
電源電壓: 2 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SOIC
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 1208 (CN2011-ZH PDF)
其它名稱: MM74HC125MXDKR
1983 Fairchild Semiconductor Corporation
www.fairchildsemi.com
MM74HC125, MM74HC126 Rev. 1.3.0
6
MM74HC125,
MM74HC126
3-ST
A
TE
Quad
Buff
er
s
Physical Dimensions
Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specications do not expand the terms of Fairchild’s worldwide terms and conditions,
specically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
LAND PATTERN RECOMMENDATION
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD:
SOIC127P600X145-14M
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
PIN ONE
INDICATOR
SEATING PLANE
DETAIL A
SCALE: 20:1
GAGE PLANE
0.25
X45°
1
0.10
C
B
C
A
7
M
14
B
A
8
SEE DETAIL A
5.60
0.65
1.70
1.27
8.75
8.50
7.62
6.00
4.00
3.80
(0.33)
1.27
0.51
0.35
1.75 MAX
1.50
1.25
0.25
0.10
0.25
0.19
(1.04)
0.90
0.50
0.36
R0.10
0.50
0.25
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MM74HC125N 制造商:Fairchild Semiconductor Corporation 功能描述:IC 74HC CMOS 74HC125 DIP14 6V
MM74HC125N/A+ 制造商:未知廠家 制造商全稱:未知廠家 功能描述:4-Bit Buffer/Driver
MM74HC125N/B+ 制造商:未知廠家 制造商全稱:未知廠家 功能描述:4-Bit Buffer/Driver