參數(shù)資料
型號: MM196
廠商: Microsemi Corporation
英文描述: 6 MOSFET Multi-Chip Module
中文描述: 6封裝的MOSFET多芯片模塊
文件頁數(shù): 1/1頁
文件大?。?/td> 66K
代理商: MM196
Microsemi
Santa Ana Division
2830 S. Fairview Street, CA. 92704, 714-979-8220, Fax: 714-557-5989
Page 1
Copyright
2000
MSC1589.PDF ,2000-09-20
W
M
.
C
MM196
6 MOSFET Multi-Chip Module
PRELIMINARY SPECIFICATION
SANTA ANA DIVISION
DESCRIPTION
The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent
MOSFET die into a convenient BGA package. This device is also available
as discrete individual packaged Powermite3, see Microsemi data sheet
UPF1N100. This device is also available as bare die, see Microsemi data
sheet MSAFA1N100D. The MM196 allows users to externally connect the
MOSFETs via a motherboard or next assembly substrate into any
configuration desired. Custom variations of this product incorporating other
Microsemi protection die and/or passive components are available by
contacting the factory.
IMPORTANT:
For the most current data, consult
MICROSEMI
’s website:
http://www.microsemi.com
INDIVIDUAL COMPONENT
Components
Manufacturer
Q1 – Q6
Microsemi Santa Ana
Characteristics
Note: Refer to individual data sheets for component performance.
If there are conflicting requirements, this document takes precedence.
SPECIFICATIONS
Part Number
MSAFA1N100D
(UNLESS OTHERWISE SPECIFIED)
Parameter
Peak Repetitive Drain
to Source Voltage
Operating Temperature
Range
Maximum Ratings @ 25oC
Symbol
Min
Max
Unit
V
DSS
1000
V
T
op
10
55
oC
(UNLESS OTHERWISE SPECIFIED)
Description
Drain-Source On-State
Resistance,
R
DS(ON)1
Maximum Ratings @ 25oC
Conditions
TYP
Max
Unit
V
GS
= 10
Vdc
,
I
D
= 1 mAdc
V
GS
= 7
Vdc
,
I
D
= 5…150
mAdc
T
C
= 37
o
C
12.5
13.5
ohm
Drain-Source On-State
Resistance,
R
DS(ON)2
12.5
ohm
M
M
1
9
6
KEY FEATURES
!"
Miniature size, Multi-Chip
Module, MCM
!"
Convenient mounting, Ball Grid
Array, BGA
!"
Sn63/Pb37 solder bumps
(Alternate attach methods
available)
!"
Maximum switch voltage 1000V
!"
Three phase switching
!"
AC-DC converters
!"
Applications utilizing multiple
MOSFET die in multiple or array
configurations
APPLICATIONS/BENEFITS
Schematic
Configuration and Dimensions
Top View
0.38” typical
Microsemi
MM196
0.35”
typical
0.050”
max
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