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參數(shù)資料
| 型號(hào)： | MLE |
| 廠商： | Littelfuse, Inc. |
| 英文描述： | Multilayer Transient Voltage Suppressor |
| 中文描述： | 多層瞬態(tài)電壓抑制器 |
| 文件頁(yè)數(shù)： | 4/7頁(yè) |
| 文件大?。?/td> | 142K |
| 代理商： | MLE |
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Surface Mount Varistors
136
www.littelfuse.com
Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are Infrared (IR) re-flow, vapour phase re-flow, and
wave soldering. When wave soldering, the MLE suppressor is attached
to the circuit board by means of an adhesive.The assembly is then
placed on a conveyor and run through the soldering process to contact
the wave. With IR and vapour phase re-flow, the device is placed in a
solder paste on the substrate. As the solder paste is heated, it reflows
and solders the unit to the board.
The recommended solder for the MLE suppressor is a 62/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Littelfuse also
recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402 size devices,
IR re-flow is recommended.
When using a reflow process, care should be taken to ensure that the
MLE chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solder
’
s peak
temperature is essential to minimize thermal shock. Examples of the
soldering conditions for the MLE series of suppressors are given in the
tables below.
Once the soldering process has been completed, it is still necessary to
ensure that any further thermal shocks are avoided. One possible cause of
thermal shock is hot printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room temperature.The
boards must be allowed to cool gradually to less than 50
o
C before cleaning.
Termination Options
Littelfuse offers two types of electrode termination finish for the
MLE series:
1. Silver/Platinum (standard) (Not 0402 and 0603 sizes)
2. Silver/Palladium (optional)
3. Nickel Barrier (optional for 0402-1210 package size)
(The ordering information section describes how to designate them.)
FIGURE 6. WAVE SOLDER PROFILE
FIGURE 7. VAPOR PHASE SOLDER PROFILE
T
o
C
TIME (MINUTES)
300
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
MAXIMUM WAVE 260
o
C
SECOND PREHEAT
FIRST PREHEAT
T
o
C
TIME (MINUTES)
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
RAMP RATE
>50
C/s
PREHEAT ZONE
MAXIMUM
TEMPERATURE 222
o
C
40-80
SECONDS
ABOVE 183
o
C
FIGURE 5. REFLOW SOLDER PROFILE
T
o
C
TIME (MINUTES)
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
MAXIMUM
PREHEAT DWELL
PREHEAT ZONE
TEMPERATURE 222
C
RAMP RATE
<2
C/s
40-80
SECONDS
ABOVE 183
o
C
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