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參數(shù)資料
| 型號： | ML63514-XXXTP |
| 廠商： | OKI ELECTRIC INDUSTRY CO LTD |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 4-BIT, MROM, MICROCONTROLLER, PQFP64 |
| 封裝： | 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 |
| 文件頁數(shù)： | 22/30頁 |
| 文件大小： | 207K |
| 代理商： | ML63514-XXXTP |
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Semiconductor
ML63512/63514
29/29
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
TQFP64-P-1010-0.50-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.26 TYP.
Mirror finish
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