參數(shù)資料
型號(hào)： MK51DX256ZCLK10
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP80
封裝： 12 X 12 MM, LQFP-80
文件頁(yè)數(shù)： 15/75頁(yè)
文件大?。?/td> 1053K
代理商： MK51DX256ZCLK10
5.3.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
85
°C
5.3.2 Thermal attributes
Board type
Symbol
Description
81 MAPBGA
80 LQFP
Unit
Notes
Single-layer
(1s)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
TBD
°C/W
Four-layer
(2s2p)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
TBD
°C/W
Single-layer
(1s)
RθJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
TBD
°C/W
Four-layer
(2s2p)
RθJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
TBD
°C/W
—
RθJB
Thermal
resistance,
junction to
board
TBD
°C/W
—
RθJC
Thermal
resistance,
junction to case
TBD
°C/W
—
ΨJT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
TBD
°C/W
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
General
K51 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
22
Preliminary
Freescale Semiconductor, Inc.
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