參數(shù)資料
型號： MK40X512VMD100
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： RISC MICROCONTROLLER, PBGA144
封裝： 13 X 13 MM, MAPBGA-144
文件頁數(shù)： 13/68頁
文件大小： 1005K
代理商： MK40X512VMD100
5.3.1 Thermal operating requirements
Table 9. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
105
°C
5.3.2 Thermal attributes
Board
type
Symbol
Description
144
LQFP
144
MAPBGA
Unit
Notes
Single-
layer (1s)
RθJA
Thermal resistance, junction to ambient (natural
convection)
52
50
°C/W
Four-layer
(2s2p)
RθJA
Thermal resistance, junction to ambient (natural
convection)
44
30
°C/W
Single-
layer (1s)
RθJMA
Thermal resistance, junction to ambient (200 ft./
min. air speed)
43
41
°C/W
Four-layer
(2s2p)
RθJMA
Thermal resistance, junction to ambient (200 ft./
min. air speed)
38
27
°C/W
—
RθJB
Thermal resistance, junction to board
33
17
°C/W
—
RθJC
Thermal resistance, junction to case
11
10
°C/W
—
ΨJT
Thermal characterization parameter, junction to
package top outside center (natural convection)
2
°C/W
6 Peripheral operating requirements and behaviors
6.1 Core modules
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
Peripheral operating requirements and behaviors
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
20
Preliminary
Freescale Semiconductor, Inc.
Preliminary
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