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參數(shù)資料
| 型號(hào)： | MK30N512VML100 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC MICROCONTROLLER, PBGA104 |
| 封裝： | 8 X 8 MM, MAPBGA-104 |
| 文件頁數(shù)： | 21/60頁 |
| 文件大?。?/td> | 877K |
| 代理商： | MK30N512VML100 |
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6.3.3.2 32kHz Oscillator Frequency Specifications
Table 16. 32kHz oscillator frequency specifications (VDD33OSC = VDD33OSC (min)
to VDD33OSC (max), TA = TL to TH)
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
fosc_lo
Oscillator crystal
—
32
—
kHz
tstart
Crystal start-up time
—
1000
—
ms
1. This parameter is characterized before qualification rather than 100% tested.
2. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFL) Electrical Characteristics
This section describes the electrical characteristics of the FTFL module.
6.4.1.1 Flash Timing Parameters — Program and Erase
The following characteristics represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 17. NVM program/erase timing characteristics
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
thvpgm4
Longword Program high-voltage time
—
20
TBD
μs
thversscr
Sector Erase high-voltage time
—
20
100
ms
thversblk
Erase Block high-voltage time
—
160
800
ms
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash Timing Parameters — Commands
Table 18. Flash command timing characteristics
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
trd1blk
Read 1s Block execution time
—
1.4
ms
trd1sec2k
Read 1s Section execution time (2 KB flash sec‐
tor)
—
40
μs
tpgmchk
Program Check execution time
—
35
μs
Table continues on the next page...
Peripheral operating requirements and behaviors
K30 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
28
Preliminary
Freescale Semiconductor, Inc.
Preliminary
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| MK40N512VLL100 | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100 |
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