
LOW PHASE NOISE VCXO AND MULTIPLIER
MDS 2732-06 F
3
Revision 091004
Integr ated Circuit System s l 525 Ra ce Stree t , Sa n Jose, CA 951 26 l te l (4 08) 297 -1 201 l
www.ics t.co m
MK2732-06
External Component Selection
The MK2732-06 requires a minimum number of
external components for proper operation.
Decoupling Capacitor
A decoupling capacitor of 0.01
F and 0.1 F must be
connected between VDD5 and GND on pins 2, 3 and 5,
6, and VDDIO and GND on pins 11 and 13, as close to
the device as possible. For optimum device
performance, the decoupling capacitor should be
mounted on the component side of the PCB. Avoid the
use of vias in the decoupling circuit.
Series Termination Resistor
When the PCB trace between the clock outputs and the
loads are over 1 inch, series termination should be
used. To series terminate a 50
trace (a commonly
used trace impedance) place a 33
resistor in series
with the clock line, as close to the clock output pin as
possible. The nominal impedance of the clock output is
20
.
Quartz Crystal
The MK2732-06 VCXO function consists of the
external crystal and the integrated VCXO oscillator
circuit. To assure the best system performance
(frequency pull range) and reliability, a crystal device
with the recommended parameters (as described in
application note MAN05) must be used, and the layout
guidelines discussed in the following section must be
followed.
The frequency of oscillation of a quartz crystal is
determined by its “cut” and by the load capacitors
connected to it. The MK2732-06 incorporates on-chip
variable load capacitors that “pull” (change) the
frequency of the crystal. The crystal specified for use
with the MK2732-06 is designed to have zero
frequency error when the total of on-chip + stray
capacitance is 14 pF.
The external crystal must be connected as close to the
chip as possible and should be on the same side of the
PCB as theMK2732-06. There should be no vias
between the crystal pins and the X1 and X2 device
pins. There should be no signal traces underneath or
close to the crystal.
Crystal Tuning Load Capacitors
The crystal traces should include pads for small fixed
capacitors, one between X1 and ground, and another
between X2 and ground. Stuffing of these capacitors
on the PCB is optional. The need for these capacitors is
determined at system prototype evaluation, and is
influenced by the particular crystal used (manufacture
and frequency) and by PCB layout. The typical required
capacitor value is 1 to 4 pF.
To determine the need for and value of the crystal
adjustment capacitors, you will need a PC board of
your final layout, a frequency counter capable of about
1 ppm resolution and accuracy, two power supplies,
and some samples of the crystals which you plan to
use in production, along with measured initial accuracy
for each crystal at the specified crystal load
capacitance, CL.
To determine the value of the crystal capacitors:
1. Connect VDD of the MK2732-06 to 3.3 V. Connect
pin 3 of the MK2732-06 to the second power supply.
Adjust the voltage on pin 3 to 0V. Measure and record
the frequency of the CLK output.
2. Adjust the voltage on pin 3 to 3.3 V. Measure and
record the frequency of the same output.
To calculate the centering error:
Where:
ftarget = nominal crystal frequency
errorxtal =actual initial accuracy (in ppm) of the crystal
being measured
If the centering error is less than ±25 ppm, no
adjustment is needed. If the centering error is more
than 25 ppm negative, the PC board has excessive
stray capacitance and a new PCB layout should be
considered to reduce stray capacitance. (Alternately,
the crystal may be re-specified to a higher load
capacitance. Contact ICS for details.) If the centering
Error
10
6x
f3.0V ftet
arg
–
()
f0V ftet
arg
–
()
+
ftet
arg
------------------------------------------------------------------------------
errorxtal
–
=