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參數(shù)資料
| 型號： | MIP7965-750F17T |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 750 MHz, MICROPROCESSOR, CQFP208 |
| 封裝： | 1.120 X 1.120 INCH, CERAMIC, QFP-208 |
| 文件頁數(shù)： | 3/18頁 |
| 文件大小： | 310K |
| 代理商： | MIP7965-750F17T |
11
SCD7965 Rev H 10/01/10
Aeroflex Plainview
THERMAL INFORMATION
This product is designed to operate over a wide temperature range when used with a heat sink.
Notes
1. Short-term is understood as the definition stated in Telcordia Generic Requirements GR-63-Core.
2.
θJC, the junction-to-case thermal resistance, θJB, the junction-to-board thermal resistance are obtained from Package vendor.
3.
θSA is the thermal resistance of the heat sink to ambient. θCS is the thermal resistance of the heat sink attached material.
Device Compact Model 256-TBGA
2,3
θJC (°C/W)
0.43
θJB (°C/W)
2.92
θJA (°C/W)
15.85
Device Compact Model 208-Lead CQFP F17 and F24
2
θJC (°C/W)
1.28
Operating power is dissipated in any package (watts) offered at worst case power supply
Power at 750 MHz
VccInt = 1.3 V, VccIO = 3.3 V
5.0W
Power at 668 MHz
VccInt = 1.3 V, VccIO = 3.3 V
4.5W
SA
Θ
ΘCS
Θ
ΘJC
JB
Θ
Ambient
Heat Sink
Case
Junction
Board
Device Compact
Model
JC
Θ
Case
Junction
Device Compact
Model
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