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參數(shù)資料
| 型號(hào)： | MGQ-388-FREQ-STBY5-TOL4-CL |
| 元件分類： | 晶體 |
| 英文描述： | QUARTZ CRYSTAL RESONATOR, 1.2 MHz - 1.69 MHz |
| 文件頁數(shù)： | 3/5頁 |
| 文件大?。?/td> | 61K |
| 代理商： | MGQ-388-FREQ-STBY5-TOL4-CL |
1
Quartz Crystal Unit Handling Precautions
1.
Mounting Precautions
1.1
Lead Type Crystal Units
1.1.1 Structure
Tubular crystal units (VT, VTC, MGQ, and MAT) are hermetically sealed using glass (see Figures 1 and 2).
1.1.2
Unbending the lead
(1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force
may crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of
the characteristics and may also break the crystal chip (see Figure 3).
1.1.3 Bending the lead
(1) Bend the lead so that the lead remains straight for more than 0.5mm from the case when soldering after bending
a lead. If not, the glass may be cracked (see Figures 5 and 6).
(2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the
bottom of lead tightly.(see Figure 4).
1.1.4 Soldering
Heat the lead wire at a temperature of less than 280
°C for 5 seconds or less, when mounting or removing a
crystal unit. A long period time of heating may result in deterioration of the characteristics and may break the
crystal unit.
(2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7).
Make the length from the case to the printed
circuit board (L) longer than the case diameter
(D) so that the lead wire will not be pulled if the
crystal unit falls over.
Soldering directly to the case will reduce the degree of vacuum and may result
in deterioration of the characteristics and may break the crystal chip.
Breakage
Pull out
Figure 3
Tweezers or
needle-nose pliers
Case
Lead
Figure 4
Solder
Printed circuit board
0.5mm
Figure 5
Figure 6
0.5mm
Solder
D
L
Solder
L>D
Figure 7
Hermetic
Glass
Lead
Case
Figure 1
Case
Lead
Figure 2
Hermetic
Glass
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