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參數(shù)資料
| 型號(hào)： | MGH2815DZ/883 |
| 廠商： | CRANE ELECTRONICS INC |
| 元件分類： | 電源模塊 |
| 英文描述： | 2-OUTPUT 1.5 W DC-DC REG PWR SUPPLY MODULE |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 116K |
| 代理商： | MGH2815DZ/883 |
1.000
(25.40)
0.870 (22.10)
0.060 (1.52)
0.075 (1.91)
0.030 (0.76)
0.100 (2.54) 4X
0.100 (2.54) 16X
B8-7
CASE B
CASES
CASE B
TOP VIEW
See Figure 6
for pin
configurations.
0.880 max
(22.35)
Materials
Header
Kovar/Nickel/Gold
Cover
Kovar/Nickel
Pins
Kovar/Nickel/Gold,
matched glass seal
Case dimensions in inches (mm)
Tolerance
±0.005 (0.13) for three decimal places
±0.01 (0.3) for two decimal places
unless otherwise specified
Cover marking is oriented with pin one
at the upper right corner.
1.010 max
(25.65)
CAUTION
Maximum reflow temperature is 220
°C for a
maximum of 30 seconds. SN60, SN62, or SN63
are the recommended types of solder. See below
for Solder Mask instructions.
Hand soldering should not exceed 300
°C for 10
seconds per pin.
Differently colored glass bead around pin one or dimple
in header (bottom or side of case) indicates pin one.
(This view shows
straight leads.)
Gull Wing Leads
Option
0.135 ref. (3.43)
Gull wing leads are solder dipped.
Lead dimensions are prior to solder dip.
0.08
(2.0)
0.010 (0.25)
Bottom of case to
bottom of lead
0.055
(1.40)
0.070
(1.78)
0.08 (2.0)
1.140 ref. (28.96)
1
FMGA EMI Filter: Screening – Standard, ES, or 883
MGH Series: Screening – Standard, ES, or 883
TOP VIEW CASE B
0.010
(0.25)
1.870 ref. (47.50)
0.015
(0.38)
0.010
(0.25)
0.900 (22.86)
0.800 (20.32)
0.700 (17.78)
0.600 (15.24)
0.500 (12.70)
0.400 (10.16)
0.300 ( 7.62)
Differently colored glass bead around pin one or dimple in
header (bottom or side of case) indicates pin one.
Cover marking is oriented with pin one at the upper right corn
1
2
3
4
5
6
8
9
7
18
17
16
15
14
13
12
11
10
0.000
Straight Leads
0.50
(12.7)
0.250 max.
(6.35)
0.200 ( 5.08)
0.100 ( 2.54)
Seam seal
Solder Mask Notes
1. Pad dimensions are for the solder mask opening. Lead common to
each other can be connected underneath as desired.
2. Ground pins should be connected to the center pad for improved
grounding.
3. Center pad should not have a solder mask. Solder, copper, or Au/Ni
plate are preferred over solder for adhesive attach.
4. Solder coat to solder down converter.
5. If less rotation of case is desired, make the pad width 0.020inches
(0.51 mm). Pad length can be extended 0.010 inches (0.25 mm)
towards the case body and as-desired dimension away from the case
body.
6. Do not exceed 220°C as measured on the body of the converter (top
or bottom).
7. Attach the body of the case to the board with a thermally conductive
adhesive or SN60, 62, or 63 solder. The adhesive can be electrically
conductive as well. It can be applied as an underfill post solder or
dispensed and cured prior or during solder.
Note: Although every effort has been made to render the case drawings at actual size, variations in the printing process may cause some distortion. Please refer
to the numerical dimensions for accuracy.
FIGURE 6: CASE B
FIGURE 7: CASE B SOLDER MASK
FIGURE 5: CASE B MAXIMUM DIMENSIONS
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