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參數(shù)資料
| 型號(hào)： | MF1ICS5005 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Standard Card IC Specification “bumped sawn wafer on UV-tape” |
| 中文描述： | 標(biāo)準(zhǔn)卡IC規(guī)范“撞鋸晶圓紫外線磁帶” |
| 文件頁(yè)數(shù)： | 3/7頁(yè) |
| 文件大?。?/td> | 45K |
| 代理商： | MF1ICS5005 |
Philips Semiconductors
Product Specification Rev. 3.0 August 2004
Bumped sawn wafer on UV-tape
Standard Card IC MF1 IC S50 05
3
PUBLIC
1 SCOPE
The MF1 ICS 50 05 is a contactless Smart Card IC
designed for card IC coils following the MIFARE
Card IC Coil Design Guide and is qualified to work
properly in Philips′ reader environment, which is
built according to Philips′ specification.
This specification describes electrical, physical and
dimensional properties of sawn bumped wafers on
UV-tape.
2 REFERENCE DOCUMENTS
2.1 Philips Documents
Data Sheet “General Specification for 8” Wafer
on UV-tape”
Data Sheet “Au Bumps Layout Rules and
Specification”
Data Sheet “Standard Card IC MF1 IC S50
Memory Contents After Test”
Data Sheet “Standard Card IC MF1 IC S50
Functional Specification”
Product Qualification Package “Standard Card
IC MF1 IC S50 05”
Application Note “MIFARE
Card IC Coil Design
Guide”
3 MECHANICAL SPECIFICATION
3.1 Wafer
Diameter:
Thickness:
Flatness:
PGDW:
8”
150 μm ± 15 μm
not applicable
24892
3.2 Wafer Backside
Material:
Treatment:
Roughness:
Si
ground and etched
R
a
max. 0.5 μm
R
t
max. 5 μm
3.3 Chip Dimensions
Chip size:
Scribe lines:
1.11 x 1.06 mm
x-line:
y-line:
91.2 μm
91.2 μm
3.4 Passivation
Type:
Material:
Thickness:
sandwich structure
PSG / Nitride (on top)
500 nm / 600 nm
3.5 Au Bump
Bump material:
Bump hardness:
Bump shear strength:
Bump height:
Bump height uniformity:
-
within a die:
-
within a wafer:
-
wafer to wafer:
Bump flatness:
Bump size:
-
LA, LB, VSS
1
-
TESTIO
Bump size variation:
Under bump metallisation:
> 99.9% pure Au
35 – 80 HV 0.005
> 70 MPa
18 μm
± 2 μm
± 3 μm
± 4 μm
± 1.5 μm
104 x 104 μm
89 x 104 μm
± 5 μm
sputtered TiW
4 ORDERING INFORMATION
4.1 Bumped die on sawn wafer
Order Code:
12NC:
MF1ICS5005W/V1D
9352 774 55005
Note: Substrate is connected to VSS.
1
Pads VSS and TESTIO are disconnected when wafer is sawn.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MF1ICS5005V1D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Standard Card IC Specification “bumped sawn wafer on UV-tape” |
| MF1ICS5005W/S7D,00 | 功能描述:射頻發(fā)射器 MF1ICS5005W/UNCASED/FOIL//S7D RoHS:否 制造商:Micrel 類型:ASK Transmitter 封裝 / 箱體:SOT-23-6 工作頻率:300 MHz to 450 MHz 封裝:Reel |
| MF1ICS5005W/V1D | 功能描述:射頻發(fā)射器 MIFARE 1K UV FFC BUMP RoHS:否 制造商:Micrel 類型:ASK Transmitter 封裝 / 箱體:SOT-23-6 工作頻率:300 MHz to 450 MHz 封裝:Reel |
| MF1ICS5005W/V1D,00 | 功能描述:射頻發(fā)射器 MIFARE 1K UV FFC RoHS:否 制造商:Micrel 類型:ASK Transmitter 封裝 / 箱體:SOT-23-6 工作頻率:300 MHz to 450 MHz 封裝:Reel |
| MF1ICS5005W/V9D | 功能描述:射頻發(fā)射器 MIFARE 1K UV FFC RoHS:否 制造商:Micrel 類型:ASK Transmitter 封裝 / 箱體:SOT-23-6 工作頻率:300 MHz to 450 MHz 封裝:Reel |
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