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參數資料
| 型號： | ME-PLCC-32-AT |
| 廠商： | METHODE ELECTRONICS INC |
| 元件分類： | 插座 |
| 英文描述： | PLCC32, IC SOCKET |
| 文件頁數： | 5/6頁 |
| 文件大?。?/td> | 632K |
| 代理商： | ME-PLCC-32-AT |
1700 Hicks Road Rolling Meadows, IL 60008 USA
Telephone: 847.392.3500 Fax: 847.392.9404
email: mcpsales@methode.com Web Page: www.methode.com
Connector Products
Specifications
Materials
Contact Material: Beryllium Copper
Contact Plating: Tin/Lead over Nickel
Insulator Material: Polyphenylene Sulfide, UL 94V-0
Operating Temperature: -50
°C to +125°C
Mechanical Performance
Durability: Per MIL-STD-1344, method 2016, 100 cycles
Vibration: Per MIL-STD-810C, method 514.2, 10-
20,000 Hz, 5 Gs
Shock: Per MIL-STD-810C, method 516.2, 35 Gs
Acceleration: Per MIL-STD-810C, method 513.2, 15 Gs
Electrical Performance
Contact Interface Resistance:
Initial: 6.5 milliohms average
Final: 15.0 milliohms maximum after testing
Insulation Resistance: Greater than 1 x 104 megohms
Dielectric Strength: 1000 VAC continuous for 1 minute
Capacitance: Less than 1.0 pF at 1,000 Hz
Inductance:
Self: 5.0 nH, maximum at 500 KHz
Mutual: 1.0 nH, maximum at 500 KHz
Environmental Performance
Thermal Shock: Per MIL-STD-1344, method 1002,
condition A, cycled form -55
°C to +85°C no
discontinuity or physical damage
Temperature/Humidity: Per MIL-STD-1344, method
1002, 85
°C/85% relative humidity
Agency Approvals:
UL Component Recognition File E-48567
Canadian Standards Association File 52212
Methode has designed this PLCC socket to take full
advantage of surface mount technology. The exclusive
visible internal solder tails along with the use of quality
high temperature materials assure compatibility with all
common reflow processes. This unique configuration
combines the handling and real estate advantages of the
J-lead with the processing, inspection and repair
advantages of the gull wing. The small overall package
dimensions allow the use of sockets with minimum
sacrifice in space. A center pad is provided in insure
structural integrity and provide a surface for vacuum pick
up or adhesive bonding. The socket uses the same
board pattern as the standard JEDEC chip and the
exposed tails insure full cleaning with maximum
drainage. The exclusive high pressure contact system
eliminates the need for gold plating while assuring a
reliable, cost effective way to provide a surface mount
socket for lead chip carriers.
Features
s
Patented design allows for inspection and repair of
surface mount connections
s
.200 (5.08) total mated height
s
Uses the same mounting pattern as mating chip
s
Fully compatible with all surface mount processing
s
Exposed solder tails for cleaning and maximum
drainage
s
Center pad for vacuum pick and place robotic
assemble and/or adhesive bonding
s
Optional polarizing pegs available
s
Visual and mechanical polarization
s
Extraction tool slots
s
Contact design provides constant downward force on
chip to prevent disengagement
s
Preloaded contact provides low insertion force while
maintaining high normal force
s
Available in 20, 28, 32, 44, 52, 68 and 84 positions
Low Profile/Surface Mount
Chip Carrier Socket
Patent No. 4,934,944
Extraction Tool CT-2102
Designed specifically
for chip extraction from
populated P.C. boards
5
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