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參數(shù)資料
| 型號(hào)： | MDM |
| 廠商： | ITT Corporation |
| 英文描述： | Micro-D Metal Shell - .050 Contact Spacing |
| 中文描述： | 微三維金屬外殼- .050聯(lián)系間距 |
| 文件頁數(shù)： | 2/11頁 |
| 文件大?。?/td> | 318K |
| 代理商： | MDM |
8
www.ittcannon.com
Dimensions shown in inch (mm)
Specifications and dimensions subject to change
Micro-D Metal Shell - .050" Contact Spacing
MDM
How to Order
For MIL-DTL-83513 ordering information see pages 16 and 17
SERIES
CONTACT ARRANGEMENTS
RoHS COMPLIANCE
MDM
51
P
H
001
P
XXX
-
-
SERIES
MDM: (Size 9-100) Liquid Crystal Polymer (LCP)
MDM: (Combo Layout) Diallyl Phthalate (DAP)
CONTACT ARRANGEMENTS
9-15-21-25-31-37-51-100 (standard)
16C5, 10C10, 7C2, 24C4 (coaxial)
16P5, 10P10, 7P2, 24P4 (power)
CONTACT TYPE
P - Pin S - Socket
TERMINATION TYPE
H - Harness-insulated wire.
L - Solid-uninsulated wire.
S - Solder pot to accept #26 AWG MAX.
harness wire. (Not available with power
contact arrangements.)
CONTACT TYPE
TERMINATION TYPE
TERMINATION CODE
HARDWARE
TERMINATION CODE*
(H) 001 - 18",7/34 strand,#26 AWG,
MIL-W-16878/4, Type E Teflon, yellow.
(H) 003 - 18", 7/34 strand, #26 AWG,
MIL-W-16878/4, Type E Teflon,
color coded to MIL-STD-681 System I.
(L) 1 - 1/2" uninsulated solid #25
AWG gold plated copper.
(L) 2 - 1" uninsulated solid #25 AWG
gold plated copper.
HARDWARE
M - Military specification hardware, see
page 11 for military hardware codes.
P - Jackpost
K - Jackscrew-standard profile
L - Jackscrew-low profile
F - Float mount
B - No hardware standard
.091 (2.31) dia. hole for sizes 9-51;
.120 (3.05) dia. hole for size 100.
A - .125 (3.18) dia. mounting holes for sizes 9-51;
.166 (4.22) dia. hole for size 100.
B1 - .1475 (3.75) dia. hole for size 100
(Per MIL-DTL-83513)
No Number - (Standard cadmium/yellow
chromate over nickel
A174 - Electroless nickel
A172 - Gold over nickel
A141 - Irridite/alodine
A30 - Black anodize
*See page 79 and 81 for additional Termination codes.
or combination of
coax and power
}
SHELL FINISH MOD CODES
SHELL FINISH MOD CODES
R
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| MDM01-A9 | 功能描述:CONN 9POS PLUG SOLDER CUP RoHS:否 類別:連接器，互連式 >> D-Sub 系列:MIL-DTL-83513，Micro D 金屬外殼 (MDM) 標(biāo)準(zhǔn)包裝:1 系列:Combo D®, D*M 連接器類型:D-Sub，組合式 位置數(shù):24 行數(shù):2 外殼尺寸，連接器布局:5（DD，D）- 24W7 觸點(diǎn)類型：:電源和信號(hào) 連接器類型:插座，母形插口 安裝類型:面板安裝，通孔，直角 法蘭特點(diǎn):板側(cè)（4-40） 端子:焊接 特點(diǎn):屏蔽 外殼材料，表面處理:鋼，帶黃色鉻酸鹽鋅鍍層 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:閃光 防護(hù)等級(jí):- 工作溫度:-55°C ~ 125°C 額定電壓:- 額定電流:40A，7.5A 體座材料:聚酯 顏色:黑 其它名稱:IDDME24H7SJ |
| MDM01-A9-A174 | 制造商:ITT Interconnect Solutions 功能描述:M83513/01-AN / 154170-0009 - Bulk |
| MDM01-B15 | 功能描述:CONN 15POS PLUG SOLDER CUP RoHS:否 類別:連接器，互連式 >> D-Sub 系列:MIL-DTL-83513，Micro D 金屬外殼 (MDM) 標(biāo)準(zhǔn)包裝:1 系列:Combo D®, D*M 連接器類型:D-Sub，組合式 位置數(shù):25 行數(shù):2 外殼尺寸，連接器布局:4（DC，C）- 25W3 觸點(diǎn)類型：:信號(hào)和同軸或電源（未包括） 連接器類型:插頭，公引腳 安裝類型:面板安裝，通孔 法蘭特點(diǎn):體座/外殼（無螺紋） 端子:焊接 特點(diǎn):屏蔽 外殼材料，表面處理:鋼，帶黃色鉻酸鹽鋅鍍層 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:閃光 防護(hù)等級(jí):- 工作溫度:-55°C ~ 125°C 額定電壓:- 額定電流:7.5A 體座材料:聚酯 顏色:黑 其它名稱:IDCM25W3PZ |
| MDM01-B15-A174 | 制造商:ITT Interconnect Solutions 功能描述:M83513/01-BN 154172-0009 - Bulk |
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