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參數資料
| 型號： | MD80C32EXXX-30MQ |
| 廠商： | TEMIC SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, 30 MHz, MICROCONTROLLER, CDIP40 |
| 封裝： | CERAMIC, DIP-40 |
| 文件頁數： | 13/20頁 |
| 文件大?。?/td> | 194K |
| 代理商： | MD80C32EXXX-30MQ |
9
42073AS-MCU Wireless-02/13
ATmega2564/1284/644RFR2
4 Application Circuits
4.1 Basic Application Schematic
A basic application schematic of the ATmega2564/1284/644RFR2 with a single-ended
RF connector is shown in Figure 4-1 below and the associated Bill of Material in Table
4-1 on page 10. The 50 single-ended RF input is transformed to the 100 differential
RF port impedance using Balun B1. The capacitors C1 and C2 provide AC coupling of
the RF input to the RF port, capacitor C4 improves matching.
Figure 4-1. Basic Application schematic (48-pin package)
6
5
4
3
2
1
13
14
15
16
17
18
19
20
40
41
42
43
44
45
46
47
P
F
0
AVSS
RFP
RFN
AVSS
TST
D
V
S
D
V
D
X
T
A
L
2
D
E
V
D
A
V
D
E
V
D
A
V
S
X
T
A
L
1
31
32
33
34
35
36
PE0
CB3
CB4
RSTN
VDD
XTAL
CX1
CX2
CB1
VDD
CB2
B1
RF
C4
21
22
23
24
12
11
10
9
8
7
48
38
39
37
25
26
27
28
29
30
XTAL
32kHz
CX3
CX4
CLKI
PB0
PB7
P
E
7
P
E
5
PF7
PG1
P
D
0
Pins TST & CLKI
must be connected
PG3
P
D
7
P
G
4
PF3/4
C1
The power supply bypass capacitors (CB2, CB4) are connected to the external analog
supply pin (EVDD, pin 44) and external digital supply pin (DEVDD, pin 16). The
capacitor C1 provides the required AC coupling of RFN/RFP.
Floating pins can cause excessive power dissipation (e.g. during power on). They
should be connected to an appropriate source. GPIO shall not be connected to ground
or power supply directly.
The digital input pins TST and CLKI must be connected. If pin TST will never be used it
can be connected to AVSS while an unused pin CLKI could be connected to DVSS (see
chapter "Unused Pins" on page 7).
Capacitors CB1 and CB3 are bypass capacitors for the integrated analog and digital
voltage regulators to ensure stable operation and to improve noise immunity.
Capacitors should be placed as close as possible to the pins and should have a low-
resistance and low-inductance connection to ground to achieve the best performance.
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