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參數(shù)資料
| 型號： | MCZ33887EK |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | 5.0 A H-Bridge with Load Current Feedback |
| 中文描述： | 5.0的H -橋的負載電流反饋 |
| 文件頁數(shù)： | 8/37頁 |
| 文件大?。?/td> | 524K |
| 代理商： | MCZ33887EK |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
8
33887
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS
(9)
,
(10)
,
(11)
,
(12)
Junction-to-Board (Bottom Exposed Pad Soldered to Board)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JB
~7.0
~8.0
~9.0
°
C/W
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)
(13)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JA
~ 41
~ 50
~ 62
°
C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
(14)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JMA
~ 18
~ 21
~ 23
°
C/W
Junction-to-Case (Exposed Pad)
(15)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JC
~ 0.8
~1.2
~2.0
°
C/W
Notes
9
10
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
θ
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness. Maximum current at maximum die
temperature represents ~ 16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R
θ
JC
-total must be
less than 5.0 °C/W for maximum load at 70°C ambient. Module thermal design must be planned accordingly.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Indicates the maximum thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
11
12
13
14
15
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
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相關(guān)代理商/技術(shù)參數(shù) |
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| MCZ33887EKR2 | 功能描述:馬達/運動/點火控制器和驅(qū)動器 H-BRIDGE W/LD CUR FDBK RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| MCZ33887EKR2DH | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:5.0 A H-Bridge with Load Current Feedback |
| MCZ33889BEG | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC-LITE-LS-CAN RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MCZ33889BEG | 制造商:Freescale Semiconductor 功能描述:IC SYSTEM BASIS W/CAN TRANCEIVER |
| MCZ33889BEG/R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:System Basis Chip with Low Speed Fault Tolerant CAN Interface |
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