
D2
Socket for Memory Module Board
MCR89 Series
sFeatures
1. High Reliability
This socket achieves high reliability in the horizontal
contact spring system.
2. Low Insertion Force
This socket prevents mis-insertion force in the preload
structure.
3. Easy Pattern Design
The dip contact through-hole diameter is only 0.5, and
simplifies the pattern design.
4. Miniature Type and High Density Mounting
The low profile with 6.2mm height from the board is
suitable for miniaturization of equipment. The 1.27mm pitch
between contacts assures mounting with high density.
5. Wide Effective Mounting Area
This socket is capable of widening the effective mounting
area on the module printed board, and secures retention
function by easy locking.
6. Easy Board Mounting
The fixing pins are arranged in the same alignment as the
contact, so as to easily install the connector in the board.
7. Accessories
Dust covers and jigs to remove the board are available.
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range
and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
Designed in Miniature 2
Contacts with High
Precision Spring
FEM Design
Simulation
500A DC
500V DC / 1 minute
100mA
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.
96 hours at temperature of 40 and humidity of 90% to 95%
5 cycles under following condition;
Temperature : -55: 30 minutes
+5 to 35: 5 minutes max.
85
: 30 minutes
15- to 30 5 minutes max.)
200 cycles
Manual soldering: 300 for 3 seconds
Rating
Operating Temperature Range: -30 to +85
(Note 1)
Operating Humidity Range: 40 to 80%
Current rating: 0.5A
Voltage rating: 125V AC
Storage Temperature Range: -10 to +60
(Note 2)
Storage Temperature Range: 40 to 70% (Note 2)
1000M
ohms min.
No flashover or insulation breakdown.
20m
ohms max.
No electrical discontinuity of 10 s or more
Insulation Resistance:1000M ohms min.
No damage, cracks, or parts looseness.
Contact resistance: 20m
ohms max.
No deformation of components affecting performance.
1. Contact Resistance
2. Withstanding voltage
3. Insulation Resistance
4. Vibration
5. Humidity (Steady state)
6. Temperature Cycle
7.
Durability (Insertion/withdrawal)
8. Resistance to Soldering heat
Item
Specification
Conditions
sProduct Specifications
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.