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參數(shù)資料
| 型號(hào)： | MCP607-I/PG |
| 元件分類： | 運(yùn)算放大器 |
| 英文描述： | DUAL OP-AMP, 250 uV OFFSET-MAX, 0.155 MHz BAND WIDTH, PDIP8 |
| 封裝： | 0.300 INCH, PLASTIC, DIP-8 |
| 文件頁(yè)數(shù)： | 38/42頁(yè) |
| 文件大?。?/td> | 690K |
| 代理商： | MCP607-I/PG |
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2009 Microchip Technology Inc.
DS11177F-page 5
MCP606/7/8/9
TEMPERATURE CHARACTERISTICS
1.1
Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-2 and Figure 1-3. The bypass
capacitors are laid out according to the rules discussed
in
FIGURE 1-2:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
FIGURE 1-3:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
Electrical Characteristics: Unless otherwise indicated, V
DD = +2.5V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
—
+85
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23
θ
JA
—
220.7
—
°C/W
Thermal Resistance, 8L-PDIP
θ
JA
—89.3
—
°C/W
Thermal Resistance, 8L-SOIC
θ
JA
—
149.5
—
°C/W
Thermal Resistance, 8L-TSSOP
θ
JA
—
139
—
°C/W
Thermal Resistance, 14L-PDIP
θ
JA
—70
—
°C/W
Thermal Resistance, 14L-SOIC
θ
JA
—95.3
—
°C/W
Thermal Resistance, 14L-TSSOP
θ
JA
—
100
—
°C/W
Note 1:
The MCP606/7/8/9 operate over this extended temperature range, but with reduced performance. In any case, the
Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.
VDD
RG
RF
RN
VOUT
VIN
VDD/2
1F
CL
RL
VL
0.1 F
MCP60X
VDD
RG
RF
RN
VOUT
VDD/2
VIN
1F
CL
RL
VL
0.1 F
MCP60X
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