參數(shù)資料
型號: MCP3424T-E/SL
廠商: Microchip Technology
文件頁數(shù): 3/58頁
文件大?。?/td> 0K
描述: IC ADC 18BIT 3.75SPS 4CH 14-SOIC
產(chǎn)品培訓(xùn)模塊: MCP3901 Analog Front End
標(biāo)準(zhǔn)包裝: 2,600
位數(shù): 18
采樣率(每秒): 3.75
數(shù)據(jù)接口: I²C,串行
轉(zhuǎn)換器數(shù)目: 1
電壓電源: 單電源
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SOIC
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 8 個單端,雙極;4 個差分,雙極
配用: MCP3424EV-ND - EVALUATION BOARD FOR MCP3424
其它名稱: MCP3424T-E/SLTR
2009 Microchip Technology Inc.
DS22088C-page 11
MCP3422/3/4
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
3.1
Analog Inputs (CHn+, CHn-)
CHn+ and CHn- are differential input pins for
channel n. The user can also connect CHn- pin to VSS
for a single-ended operation. See Figure 6-4 for
differential and single-ended connection examples.
The maximum voltage range on each differential input
pin is from VSS-0.3V to VDD+0.3V. Any voltage below or
above this range will cause leakage currents through
the Electrostatic Discharge (ESD) diodes at the input
pins.
This ESD current can cause unexpected performance
of the device. The input voltage at the input pins should
be within the specified operating range defined in
and
details of the input voltage range.
Figure 3-1 shows the input structure of the device. The
device uses a switched capacitor input stage at the
front end. CPIN is the package pin capacitance and
typically about 4 pF. D1 and D2 are the ESD diodes.
CSAMPLE is the differential input sampling capacitor.
3.2
Supply Voltage (VDD, VSS)
VDD is the power supply pin for the device. This pin
requires an appropriate bypass ceramic capacitor of
about 0.1 F to ground to attenuate high frequency
noise presented in application circuit board. An
additional 10 F capacitor (tantalum) in parallel is also
recommended to further attenuate current spike
noises. The supply voltage (VDD) must be maintained
in the 2.7V to 5.5V range for specified operation.
VSS is the ground pin and the current return path of the
device. The user must connect the VSS pin to a ground
plane through a low impedance connection. If an
analog ground path is available in the application PCB
(printed circuit board), it is highly recommended that
the VSS pin be tied to the analog ground path or
isolated within an analog ground plane of the circuit
board.
MCP3422
MCP3423
MCP3424
Sym
Description
DFN
MSOP,
SOIC
DFN
MSOP
SOIC,
TSSOP
1
CH1+
Positive Differential Analog Input Pin of Channel 1
2
CH1-
Negative Differential Analog Input Pin of Channel 1
7
4
3
CH2+
Positive Differential Analog Input Pin of Channel 2
8
5
4
CH2-
Negative Differential Analog Input Pin of Channel 2
66
3
5
VSS
Ground Pin
33
6
VDD
Positive Supply Voltage Pin
4
7
SDA
Bidirectional Serial Data Pin of the I2C Interface
5
8
SCL
Serial Clock Pin of the I2C Interface
——
9
Adr0
I2C Address Selection Pin. See Section 5.3.2.
10
Adr1
I2C Address Selection Pin. See Section 5.3.2.
11
CH3+
Positive Differential Analog Input Pin of Channel 3
12
CH3-
Negative Differential Analog Input Pin of Channel 3
13
CH4+
Positive Differential Analog Input Pin of Channel 4
14
CH4-
Negative Differential Analog Input Pin of Channel 4
9
11
EP
Exposed Thermal Pad (EP); must be connected to
VSS.
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