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| 型號(hào)： | MCP2510-I/P |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 1 CHANNEL(S), 1M bps, LOCAL AREA NETWORK CONTROLLER, PDIP18 |
| 封裝： | 0.300 INCH, PLASTIC, DIP-18 |
| 文件頁(yè)數(shù)： | 64/80頁(yè) |
| 文件大?。?/td> | 998K |
| 代理商： | MCP2510-I/P |
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2007 Microchip Technology Inc.
DS21291F-page 67
MCP2510
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
18
Pitch
e
1.27 BSC
Overall Height
A
–
2.65
Molded Package Thickness
A2
2.05
–
Standoff §
A1
0.10
–
0.30
Overall Width
E
10.30 BSC
Molded Package Width
E1
7.50 BSC
Overall Length
D
11.55 BSC
Chamfer (optional)
h
0.25
–
0.75
Foot Length
L
0.40
–
1.27
Footprint
L1
1.40 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.20
–
0.33
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
NOTE 1
D
N
E
E1
e
b
1 2 3
A
A1
A2
L
L1
h
c
β
φ
α
Microchip Technology Drawing C04-051B
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