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參數(shù)資料
| 型號： | MCP25055-I/SL |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PDSO14 |
| 封裝： | 0.150 INCH, PLASTIC, SOIC-14 |
| 文件頁數(shù)： | 54/66頁 |
| 文件大?。?/td> | 1028K |
| 代理商： | MCP25055-I/SL |
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MCP2502X/5X
DS21664D-page 58
2007 Microchip Technology Inc.
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
.100 BSC
Top to Seating Plane
A
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.735
.750
.775
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.045
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
–
.430
N
E1
D
NOTE 1
12
3
E
c
eB
A2
L
A
A1
b1
b
e
Microchip Technology Drawing C04-005B
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCP25055T | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:CAN I/O Expander Family |
| MCP25055TE/P | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:CAN I/O Expander Family |
| MCP25055TE/SL | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:CAN I/O Expander Family |
| MCP25055TI/P | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:CAN I/O Expander Family |
| MCP25055TI/SL | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:CAN I/O Expander Family |
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