參數(shù)資料
型號: MCP25050-E/SL
廠商: Microchip Technology
文件頁數(shù): 54/66頁
文件大?。?/td> 0K
描述: IC I/O EXPANDER CAN 8B 14SOIC
標(biāo)準(zhǔn)包裝: 57
接口: CAN
輸入/輸出數(shù): 8
中斷輸出:
頻率 - 時(shí)鐘: 25MHz
電源電壓: 4.5 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SOIC
包裝: 管件
包括: ADC,存儲器,PWM
其它名稱: MCP25050E/SL
MCP2502X/5X
DS21664D-page 58
2007 Microchip Technology Inc.
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
.100 BSC
Top to Seating Plane
A
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.735
.750
.775
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.045
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
.430
N
E1
D
NOTE 1
12
3
E
c
eB
A2
L
A
A1
b1
b
e
Microchip Technology Drawing C04-005B
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