參數(shù)資料
型號: MCP25020T-E/SL
廠商: Microchip Technology
文件頁數(shù): 55/66頁
文件大?。?/td> 0K
描述: IC I/O EXPANDER CAN 8B 14SOIC
標準包裝: 2,600
接口: CAN
輸入/輸出數(shù): 8
中斷輸出:
頻率 - 時鐘: 25MHz
電源電壓: 4.5 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 14-SOIC
包裝: 帶卷 (TR)
包括: 存儲器,PWM
配用: MCP2515DM-PCTL-ND - BOARD DEMO FOR MCP2515
其它名稱: MCP25020TE/SL
2007 Microchip Technology Inc.
DS21664D-page 59
MCP2502X/5X
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
1.27 BSC
Overall Height
A
1.75
Molded Package Thickness
A2
1.25
Standoff §
A1
0.10
0.25
Overall Width
E
6.00 BSC
Molded Package Width
E1
3.90 BSC
Overall Length
D
8.65 BSC
Chamfer (optional)
h
0.25
0.50
Foot Length
L
0.40
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
Lead Thickness
c
0.17
0.25
Lead Width
b
0.31
0.51
Mold Draft Angle Top
α
15°
Mold Draft Angle Bottom
β
15°
NOTE 1
N
D
E
E1
1
2
3
b
e
A
A1
A2
L
L1
c
h
α
β
φ
Microchip Technology Drawing C04-065B
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