參數(shù)資料
型號(hào)： MCP25020-I/P
元件分類(lèi)： 微控制器/微處理器
英文描述： SPECIALTY MICROPROCESSOR CIRCUIT, PDIP14
封裝： 0.300 INCH, PLASTIC, DIP-14
文件頁(yè)數(shù)： 54/66頁(yè)
文件大小： 1028K
代理商： MCP25020-I/P
MCP2502X/5X
DS21664D-page 58
2007 Microchip Technology Inc.
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
.100 BSC
Top to Seating Plane
A
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.735
.750
.775
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.045
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
–
.430
N
E1
D
NOTE 1
12
3
E
c
eB
A2
L
A
A1
b1
b
e
Microchip Technology Drawing C04-005B
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